10691 - 10700 of 10714
low power microcontrollers chip
Selling leads
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... MSI-X Yes NT Ports 8 Packaging Size 47.5mm x 47.5mm Ports 72 Power Typ. 49 Features Of PEX89144B0 On-chip best-in-class Broadcom32-GT/s SerDes ...
2025-07-02 00:18:48
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... Series Switch Chips. PEX9765-B080BCG: Managed PCI Express Switches Based on ExpressFabric® Technology. Specification Of PEX9765-B080BCG Part ...
2025-07-07 00:19:57
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... Switch Chips - 33-Lane, 9-Port PCI Express Gen3 ExpressFabric Device, Package Size is 27mm × 27mm. Specification Of PEX9733-AA80BCG Part Number: ...
2025-07-02 00:18:48
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...Chips, 16-Lane, 5-Port ExpressFabric Switch, Package Size is 19mm × 19mm. Specification Of PEX9716-AA80BCG Part Number PEX9716-AA80BCG DPC /eDPC ...
2025-07-02 00:18:48
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... MSCSM120AM042CT6AG Power Modules feature an extremely low inductance SP6LI package, with a maximum stray inductance of 3nH. Specification Of ...
2024-12-09 22:12:14
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...5MG121C LCMXO3L-2100E-5MG121C features help manage static and dynamic power consumption resulting in low static power for all members of the family...
2024-12-09 22:21:11
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...1200V 800A Dual IGBT Module Overview 62 mm 1200 V, 800 A dual low sat & fast trench IGBT module with TRENCHSTOP™ IGBT7 and emitter controlled 7 ...
2025-07-10 00:21:44
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... includes two monolithic front-end ICs. Each front-end IC includes a transmit amplifier with directional coupler, a low noise receive amplifier and ...
2025-07-02 00:18:47
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... precision gate bias results in higher switching SOA compared to discrete silicon gate drivers. This integration, combined with TI's low-inductance ...
2025-06-22 00:16:27
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... IC(nom) / IF(nom): 800 A IC max: 800 A Qualification: Industrial Technology: IGBT7 - E7 Features Of FF800R12KE7HPSA1 Highest power density Best-in
2024-12-09 21:19:45
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