China Integrated Circuit Chip manufacturer
ShenZhen Mingjiada Electronics Co.,Ltd.
Shenzhen Mingjiada Electronics Co., Ltd.
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ShenZhen Mingjiada Electronics Co.,Ltd.

City: shenzhen

Country/Region:china

Tel:86-0755-83294757

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10671 - 10680 of 10714

low power microcontrollers chip

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FPGA IC 10M50DCF256A7G 50000 Logical Elements Field Programmable Gate Array Product Description Of 10M50DCF256A7G 10M50DCF256A7G are single-chip, non... 2024-12-09 21:35:22
... 484-BBGA Field Programmable Gate Array Product Description Of XC7A50T-2FGG484I XC7A50T-2FGG484I is low-cost, wire-bond, bare-die flip chip, and ... 2024-12-09 21:46:53
...4300HC-5SG72I LCMXO3D-4300HC-5SG72I device family is the next generation of Low Density PLDs including enhanced security features and on-chip dual ... 2024-12-09 22:12:14
...-4300ZC-2SG72C device family is the next generation of Lattice Semiconductor Low Density PLDs including enhanced security features and on-chip dual ... 2024-12-09 22:21:11
... architecture has several features such as programmable low swing differential I/O and the ability to turn off I/O banks, on-chip PLLs and ... 2024-12-09 22:21:11
...area network (WLAN) system-on-chip (SoC) for 5 GHz 802.11ac or 2.4/5 GHz 802.11n WLAN applications. Features Of QCA9880-BR4A-R WLAN CPU supports ... 2025-07-02 00:18:48
...Chip (SoC) support increased OEM customization and are engineered to offer a rich set of audio features which have not typically been associated ... 2025-06-22 00:16:26
...75A Chassis Mount Product Description Of FP75R12N2T4BPSA1 FP75R12N2T4BPSA1 feature low inductive design, low switching losses, and low VCE(sat). ... 2025-07-10 00:21:44
..., ultra-low weight, and low junction to case thermal resistance. Specification Of MSCSM120AM03CT6LIAG Part Number MSCSM120AM03CT6LIAG Input ... 2025-07-10 00:21:44
...ultra-low weight, and low junction to case thermal resistance. Specification Of MSCSM170AM23CT1AG Part Number: MSCSM170AM23CT1AG Drain-Source ON ... 2024-12-09 22:12:14