Polyimide Base Substrates for FPC Manufacturing and Semiconductor Encapsulation & Packaging
|
Detailed Product Description
|
Polyimide Base Substrates for FPC Manufacturing and Semiconductor Encapsulation & Packaging Detail Information Place of Origin: ANHUI, CHINA Certification: UL ISO ROHS Material: Polyimide Color: Yellow Treatment: Single-side / Both Sides Width: 514MM 520MM 1028MM 1040MM Thickness: 12.5μm 20μm 18μm 25μm Packing Style: Standard Packing Application: Roll Length: Customized Packaging Details: Wooden pallet Supply Ability: 2000 ton/year Highlight: High Thermally Conductive Polyimide Insulation Film for Power
Devices Product Description Flexible Printed Circuit Base Film: High Dimensional Stability Polyimide Product Overview GL-series polyimide film features superior thermal resistance,
premium electrical insulating performance and stable dimensional
characteristics. Featuring an opaque matte black finish, the
material is extensively applied in electronic components, flexible
printed circuits and semiconductor packaging segments. It delivers
reliable functional stability and exceptional light-shielding
efficiency. Product Features It boasts superior mechanical performance, ultra-low CTE and great surface adhesiveness. The product meets RoHS & REACH standards and is safety-certified by US UL Labs. Product Applications GL high-spec polyimide film mainly serves high-precision adhesive FCCL base materials, dimensionally stable coverlays, chip packaging and specialty adhesive tape substrates. Why Choose Our Factory? Direct factory quotation service: Eliminate intermediate
distributors to provide economical price points, flexible minimum
order requirements and prompt cargo dispatch. The company owns integrated technical strengths: customized
anti-fog testing programs can be provided, together with
professional technical counseling to improve packaging functional
performance. Thickness, width and surface textures (matte, gloss, metallic) of
our polyimide substrates support personalized modification. Steady
product quality, efficient manufacturing capacity and advantageous
bulk prices are warranted. Customers may consult our team to obtain
free test samples and exclusive bulk purchasing discounts. Product pictures Handling & Storage Instructions To ensure the longevity and performance of our Polyimide film, please adhere to the following guidelines:
|
| Product Tags: Flexible Polyimide Film substrates Polyimide Base FPC manufacturing Semiconductor encapsulation Polyimide Film |
Related Products
|
Polyimide Base Substrates for FPC Manufacturing and Semiconductor Encapsulation & Packaging |
|
High-Stability Copper-Polyimide Laminates Suitable for Cyclic Flexing Scenarios |
|
Black Opaque flexible polyimide film with High Adhesion Strength for Flexible Circuits Offering Thermal Stability and Electrical Insulation |
|
OEM Transparent Polyimide Foil Film Tape For Flexible Printed Circuits |
|
Colorless Polyimide flexible polyimide film for Flexible Printed Circuits 5μm-100μm |
|
High-Reliability Copper-Polyimide Composites for Dynamic Bending Applications |
Email to this supplier