High-Stability Copper-Polyimide Laminates Suitable for Cyclic Flexing Scenarios
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Detailed Product Description
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High-Stability Copper-Polyimide Laminates Suitable for Cyclic
Flexing Scenarios Product Overview: The GL series polyimide substrates forge unprecedented performance benchmarks across the polyimide film sector. Leveraging in-house developed fabrication techniques, our product re-engineers the intrinsic molecular structure at the fundamental level. Compared with generic PI film goods, its core functional indicators such as tensile performance, dimensional stability and chemical corrosion resistance see a more than 30% performance uplift. Place of Origin: ANHUI, CHINA Material: Polyimide Color: Yellow Treatment: Single-side / Both Sides Width: 514MM, 520MM, 1028MM, 1040MM Thickness: custom Packaging: vacuum packaging Supply Ability: 2000 ton/year Product Features: excellent Mechanical Performance Remarkable Dimensional Consistency Premium Bonding Compatibility Compliant with RoHS & REACH Directives Product Applications: High-density flexible copper-clad laminates (FCCL) dedicated to FPC
manufacturing Dimensionally consistent cover films offering circuit shielding protection Cutting-edge encapsulation & packaging materials for semiconductor components High-spec base films formulated for specialized adhesive tape applications To retain the original properties and functional reliability of our
polyimide films, kindly observe the below storage requirements:
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| Product Tags: High-Stability Copper-Polyimide Laminates Flexible Polyimide Film for Cyclic Flexing Copper-Polyimide Laminates with High Stability |
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