Hefei Guofeng Advanced Basic Materials Technology Co., Ltd.

Heat-Resistant Polyimide Substrate with Superior Insulation for Flexible Printed Circuit Use

Opaque Black Thermosetting PI Heating Substrate Designed for High Heat Insulation Applications

Polyimide Base Substrates for FPC Manufacturing and Semiconductor Encapsulation & Packaging

High-Stability Copper-Polyimide Laminates Suitable for Cyclic Flexing Scenarios

Ultra High Temperature Tolerant Polyimide Masking Tape Utilized in PCB Manufacturing & Electrostatic Powder Coating Operations

Flexible PI Films for Compact Electronic Components

Polyimide Thin Film Roll – Premium Thermal & Electrical Insulator

Polyimide (PI) Film Insulation Roll – 15µm Thickness, 3000m Length

Bespoke Polyimide Film Solutions for PCB, FPC & Thermal Insulation Applications

High-Performance Polyimide Film: Superior Thermal Stability & Chemical Inertness

High-Mechanical-Strength Copper-Clad Polyimide Film for Flexible Circuitry, RoHS Certified

Premium Polyimide Film – Extreme Heat & Chemical Stability

Thermally Stable & Electrically Insulating Polyimide Thin Films (GL5 / GL12.5) for Industrial Applications

Ultra-Fine-Thickness, High-Efficiency PI Membranes Tailored for Next-Generation Tech Applications

Polyimide Thin Film GL5 Materials for Aerospace and Automotive Sectors

Industrial Polyimide Thin Film GL5 / GL12.5 for Thermal & Electrical Uses

Polyimide Thin Film GL5 & GL12.5 for Flexible Electronics and Insulation

Custom Polyimide Thin Film Options for PCB, FPC, and Thermal Barriers

Polyimide (PI) Film Insulation Roll – 12.5µm Thickness, 3000m Length

Polyimide (PI) Film Insulation Roll – 25µm Thickness, 2500m Length

Cutting-Edge Flexible Electronic Modules – Bespoke PI Polyimide Thin Films