Picosecond Laser Wafer Scribing Machine To 8 Inches Size High Precision
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Detailed Product Description
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Equipment Overview The equipment is designed for marking wafers up to 8 inches in size, as well as for scribing MARK points and characters on ITO glass.
Highlights • High-Precision Recognition: Equipped with one set of high-precision alignment cameras, two sets of global recognition cameras, and one set of self-inspection camera. • High-Precision Assembly: Features a marble base and high-precision linear motors for the drive axes. • Superior Accuracy: Delivers high marking precision and is equipped with a self-inspection function after marking.
Technical Specifications
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| Product Tags: Picosecond Laser Wafer Scribing Machine High Precision Wafer Scribing Machine |
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