Equipment Introduction The equipment’s laser system uses instantaneous high-energy-density
laser to achieve ablation and evaporation, selectively removing
masks or dielectric films, and is used to remove the BSG layer from
designated areas of battery wafers. It supports an automatic
loading and unloading system, compatible with the customer’s
on-site AGV system. Carrier cassettes are automatically loaded from
AGV to the equipment’s loading conveyor belt; silicon wafers are
picked up automatically from cassettes, conveyed directly to the
laser marking station, laser-marked after CCD visual positioning,
and then sent to the unloading cassette via the unloading conveyor
belt. Full cassettes are then transported to the on-site AGV by the
conveyor belt. Highlights - Multi-functional Assistance for Enhanced Process Performance
- Bottom-mounted platform cooling system: prevents high-temperature
interference for better process performance.
- Patented dedicated dust removal device: adopts suction-blown
convection for higher cleanliness.
- Supports fragment, micro-crack, and AOI detection.
- Laser Processing Technology for Different Film Structures
- Diversified technology routes for varied mask layer materials.
- Customizable laser sources for optimal demand matching.
- Large Spot Beam Homogenization Technology
- Ensures uniform spot energy distribution.
- Maintains stable and consistent mass production with large spot
size.
- Unique Design for Reduced Transmission Defects
- Custom grooved belt and direct motor connection: stable operation,
dust contamination prevention.
- New flat belt: prevents scratches and indentations.
- The jig uses an air knife to blow away debris and prevent
micro-cracks.
- Versatile Design for High Compatibility
- Compatible with multiple loading/unloading methods and carrier
cassettes of different specifications.
- Lifting & rotating design with dedicated storage for empty
cassettes.
- Supports fragment, micro-crack, and AOI detection.
- Precision Graphic Control Technology
- Pulse timing control: precise N/P region isolation.
- High-precision positioning.
- Visual AI algorithm development.
- Laser processing for different film structures, diversified
technology routes, and customizable laser sources.
Technical Parameters | Equipment Performance | Specification Parameters | | Operating Mode | Offline Mode | | Applicable Battery Size | Compatible with sizes up to 230*230mm (semi-cell customization
available) | | Applicable Battery Thickness | 150±50μm | | Loading/Unloading Method | AGV Robot Compatible | | Graphic Accuracy | ±15μm | | Positioning Accuracy | Edge-Grabbing Accuracy (Repeatability): ≤ ±15μm @ 182mm;
Point-Grabbing Accuracy: ≤ ±10μm @ 182mm | | Machine Capacity Example | Theoretical Capacity: (Based on laser film removal graphic
processing time) Single Laser Pass: >7200 Pcs/h for 182*91 size; >6000 Pcs/h
for 182*105 size Dual Laser Passes: >7500 Pcs/h for 182*91 size; >7000 Pcs/h
for 182*105 size | | Fragment Rate | ≤ 0.02% | | Configuration | Dual-Track 4-Head or Dual-Track 2-Head | | Spot Size | Square flat-top homogenized spot, size customizable from 100 to 500
μm. |
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