Equipment Applications Optical modules, HDMI/USB connectors, sensors, optical devices,
light source modules, driver modules, etc. Highlights - High-Precision Assembly: Equipped with SP-grade silent linear
guides with a straightness tolerance of within 2 μm (measured by
dial indicator). Adopts system laser interferometer motion
compensation technology, featuring a positioning accuracy of ±0.8
μm and a repeat positioning accuracy of ±0.4 μm. Capable of
achieving fast and high-precision fixed-duration control of 6
pulses within 100 ms, ensuring consistent precision across
batch-produced equipment and minimizing accuracy deviations caused
by moving components.
- Reduced Misjudgment: The nozzle is configured with an independent
micro-flow air circuit, enabling separate detection of each nozzle
loop to reduce system misjudgment.
- Strong Compatibility: Compatible with both optical chip and
electrical chip mounting processes.
- Professional Services: Supported by a dedicated vision technology
team, which can customize efficient and accurate positioning
solutions for various product types.
- Customization Services: A eutectic module can be added to upgrade
the equipment into a eutectic die bonder.
Technical Parameters Parameter Name | Parameter Value | Production Cycle | 3s-12s | Mounting Accuracy | ±3 ~ ±5μm@3σ | Angular Accuracy | ±0.5° @3σ | Chip Size | 0.15×0.15mm-5×5mm (Lens to be replaced per product requirements) | Chip Thickness | 0.076-1mm(3-40mil, standard)minimum thickness down to
0.05mm(2mil,optional) | Substrate Size | L: 100-300mm；W: 40-90mm(Customization optional for widths below 40
mm) H: 0.1-0.8mm(standard)0.8-2.0mm(optional) | Magazine Size | (To be provided by the customer according to product
specifications) | Wafer Size | Compatible with 6–8 inch wafers (2-inch & 4-inch waffle packs) | Automatic θ Calibration | Range of ±15° | Maximum Wafer Angle Correction | 360° | Bonding Force | 20-300g | Standard Track Width | 40-90mm | PR System | 256 grayscale levels / edge detection | Resolution | 1920pixel×2560pixel | PR Accuracy | 5M(1920×2560pixel) FOV(16mm；×1,×2,×4) | Angular Tolerance | ±0.1° | Dimensions | W: 1630mm; H: 1160mm; D: 1500mm (Subject to actual product) | Weight | 1200KG (Subject to actual product) |
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