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Shenzhen Tecircuit Electronics Limited
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IC Substrate Multilayer Rigid PCB for Mobile Phone EMMC Package Substrate

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Shenzhen Tecircuit Electronics Limited

City: shenzhen

Country/Region:china

Tel:86-0755-8487 -5025

Contact Person:
Mr.David Zeng View Contact Details

IC Substrate Multilayer Rigid PCB for Mobile Phone EMMC Package Substrate
Brand Name TECircuit
Model Number TEC0211
Certification UL,ISO 9001, ISO 14001, ISO 13485, ITAF 16949, ROHS,REACH. W
Place of Origin China
Minimum Order Quantity 1pcs for sample, 100pcs for bulk
Price USD 1.99 ~ USD9.99/pcs
Payment Terms L/C, D/A, D/P, T/T, Western Union, MoneyGram
Supply Ability 50000 pcs/month
Delivery Time 5-15 wotk days
Packaging Details Vacuum package+Carton box
Brand Shenzhen Tecircuit Electronics Co., Ltd
Product Type PCB,High frequency board,RIGID PCB,Rigid board,Flexible board,Rigid-Flex PCB,IC-Substrate,Metal Core
Item No. R0079
Service PCBA service
Detailed Product Description

Product Images

 

 

 

 

 

About TECircuit

 

Found: TECircuit has been operating since 2004.

Location: An electronics manufacturing service(EMS) provider located in Shenzhen China.

Item: Customizable EMS PCB, offers a full range of one-stop shop services.

Service: Printed Circuit Board (PCB)and Printed Circuit Board Assembly(PCBA), Flexible Printed Circuit Board(FPC), Components Sourcing, Box-Building, Testing.

Quality Assurance: UL,ISO 9001, ISO 14001, ISO 13485, ITAF 16949 andcomplied with ROHS and REACH.

Factory Pictures:
Company's own plant : 50,000 sqm; Employees : 930+; Monthly production capacity : 100,000 m2

 

Product Applications

  • Application Processors:

    • Used in the main processing units of smartphones, enabling high-performance computing and multitasking capabilities.

  • Baseband Processors:

    • Integrated into components responsible for managing wireless communication, including cellular connectivity and data transmission.

  • Power Management ICs:

    • Employed in power management solutions to optimize battery usage and charging efficiency.

  • RF Modules:

    • Used in radio frequency components for Wi-Fi, Bluetooth, and GPS functionalities, enhancing connectivity features.

  • Camera Modules:

    • Integrated into substrates that support image processing and sensor interfacing for high-quality photography.

  • Memory Modules:

    • Used in substrates for RAM and flash memory, facilitating fast data storage and retrieval.

  • Display Drivers:

    • Employed in circuits that manage displays, ensuring high resolution and responsiveness for touchscreens.

  • Audio Processing Chips:

    • Integrated into audio ICs that enhance sound quality and support advanced audio features.

  • Sensors:

    • Used in substrates for various sensors, including fingerprint scanners, accelerometers, and gyroscopes.

  • Connectivity Solutions:

    • Employed in substrates for NFC (Near Field Communication) and other connectivity technologies.

 

Product Features 

  1. High Density:

    • Designed to accommodate a large number of connections in a compact space, essential for modern smartphones.

  2. Thermal Management:

    • Features effective heat dissipation mechanisms to maintain optimal operating temperatures for high-performance components.

  3. Low Profile:

    • Compact designs enable integration into slim mobile devices without compromising functionality.

  4. Signal Integrity:

    • Engineered to minimize signal loss and interference, ensuring reliable performance for high-speed data transmission.

  5. Cost-Effectiveness:

    • Suitable for high-volume production, balancing performance with manufacturing costs.

  6. Durability:

    • Built to withstand mechanical stress and environmental conditions, ensuring reliability in everyday use.

  7. Compatibility:

    • Can be used with various semiconductor materials and technologies, enhancing design flexibility.

  8. Customizability:

    • Tailored to meet specific design requirements and application needs, supporting innovative features.

  9. Compliance with Standards:

    • Manufactured to meet industry standards for performance, safety, and environmental regulations.

  10. Ease of Assembly:

    • Designed for compatibility with automated assembly processes, improving manufacturing efficiency.

 

 

FAQ

Question 1: What is needed for a quotation?
Answer:
PCB: QTY, Gerber file, and Technical Requirements( material/surface finish treatment/copper thickness/board thickness,...)
PCBA: PCB information, BOM,(Testing documents...)

Q2: What file formats do you accept for production?
Answer:
PCB Gerber file
BOM list for PCB
Test method for PCBA

Q3: Are my files safe?
Answer:
Your files are held completely safe and secure. We protect the IP for our customers in the whole process. All documents from customers are never shared with any 3rd parties.

Q4: What is the shipment method?
Answer:
We can offer FedEx /DHL / TNT / UPS for shipment. Also, customer provided shipment method is acceptable.

Q5: What is the payment method?
Answer:
Telegraphic Transfer in advance (Advance TT, T/T), PayPal is acceptable.

​Product Description​

Specification:
PCB layers:1-42layers
PCB materials:CEM1, CEM3, Rogers, FR-4, High Tg FR-4, Aluminum Base, Halogen Free
PCB max. board size:620mm*1100mm
PCB certificate:RoHS Directive-Compliant
PCB Thickness:1.6 ±0.1mm
Out Layer Copper Thickness:0.5-5oz
Inner Layer Copper Thickness:0.5-4oz
PCB max. board thickness:6.0mm
Minimum Hole Size:0.20mm
Minimum Line Width/Space:3/3mil
Min. S/M Pitch:0.1mm(4mil)
Plate Thickness and Aperture Ratio :30:1
Minimum Hole Copper:20µm
Hole Dia. Tolerance(PTH):±0.075mm(3mil)
Hole dia. Tolerance(NPTH):±0.05mm (2mil)
Hole Position Deviation:±0.05mm (2mil)
Outline Tolerance:±0.05mm (2mil)
PCB solder mask:Black, white, yellow
PCB surface finished:HASL Leadfree,Immersion ENIG,Chem Tin,Flash Gold,OSP,Gold finger,Peelable,Immersion Silver
Legend:White
E-test:100% AOI, X-ray, Flying probe test.
Outline:Rout and Score/V-cut
Inspection Standard:IPC-A-610CCLASSII
Certificates:UL (E503048),ISO9001/ISO14001/IATF16949
Outgoing Reports:Final Inspection, E-test, Solderability Test, Micro Section and More
Product Tags: Mobile Phone Multilayer Rigid PCB   IC Substrate Mobile Phone PCB  
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