China Multilayer PCB manufacturer
Shenzhen Tecircuit Electronics Limited
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Multilayer IC Substrate PCB Board PCB Rigid Blind Vias Soft Gold

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Shenzhen Tecircuit Electronics Limited

City: shenzhen

Country/Region:china

Tel:86-0755-8487 -5025

Contact Person:
Mr.David Zeng View Contact Details

Multilayer IC Substrate PCB Board PCB Rigid Blind Vias Soft Gold
Brand Name TECircuit
Model Number TEC0207
Certification UL,ISO 9001, ISO 14001, ISO 13485, ITAF 16949, ROHS,REACH. W
Place of Origin China
Minimum Order Quantity 1pcs for sample, 100pcs for bulk
Price USD 1.99 ~ USD9.99/pcs
Payment Terms L/C, D/A, D/P, T/T, Western Union, MoneyGram
Supply Ability 50000 pcs/month
Delivery Time 5-15 wotk days
Packaging Details Vacuum package+Carton box
Brand Shenzhen Tecircuit Electronics Co., Ltd
Product Type PCB,High frequency board,RIGID PCB,Rigid board,Flexible board,Rigid-Flex PCB,IC-Substrate,Metal Core
Item No. R0075
Service PCBA service
Detailed Product Description

Product Images

 

 

 

 

 

 

About TECircuit

 

Found: TECircuit has been operating since 2004.

Location: An electronics manufacturing service(EMS) provider located in Shenzhen China.

Item: Customizable EMS PCB, offers a full range of one-stop shop services.

Service: Printed Circuit Board (PCB)and Printed Circuit Board Assembly(PCBA), Flexible Printed Circuit Board(FPC), Components Sourcing, Box-Building, Testing.

Quality Assurance: UL,ISO 9001, ISO 14001, ISO 13485, ITAF 16949 andcomplied with ROHS and REACH.

Factory Pictures:
Company's own plant : 50,000 sqm; Employees : 930+; Monthly production capacity : 100,000 m2

 

Product Applications

 

  • High-Density Interconnect (HDI) PCBs:

    • Used in HDI designs where space is limited, allowing for more connections in a smaller area.

  • Mobile Devices:

    • Integrated into smartphones and tablets to optimize space and improve performance by reducing signal paths.

  • Consumer Electronics:

    • Employed in devices like smart TVs, gaming consoles, and wearables, enhancing functionality while minimizing size.

  • Medical Devices:

    • Used in advanced medical equipment that requires compact designs and reliable performance, such as diagnostic tools and imaging systems.

  • Automotive Electronics:

    • Integrated into electronic control units (ECUs), infotainment systems, and safety features, where reliability and space efficiency are critical.

  • Telecommunications Equipment:

    • Employed in base stations, routers, and switches, facilitating high-speed data transmission with reduced latency.

  • Aerospace and Defense:

    • Used in military and aerospace applications to ensure compact and lightweight designs without compromising performance.

  • LED Lighting:

    • Integrated into circuit boards for LED applications, improving thermal management and connectivity.

  • RF and Microwave Applications:

    • Employed in RF and microwave circuits, where minimizing signal loss and enhancing performance is essential.

  • Power Management Systems:

    • Used in power converters and regulators, optimizing space for increased efficiency and reliability.

 

Product Features 

  1. Space Efficiency:

    • Allows for a higher density of interconnections, making it ideal for compact designs.

  2. Reduced Signal Path:

    • Minimizes the distance between layers, reducing signal loss and improving performance.

  3. Improved Thermal Management:

    • Facilitates better heat dissipation due to shorter signal paths and optimized layouts.

  4. Enhanced Reliability:

    • Blind vias are less prone to defects compared to through-hole vias, enhancing durability in critical applications.

  5. Flexibility in Design:

    • Offers designers greater freedom in routing and layout, accommodating complex circuitry.

  6. Compatible with Multiple Technologies:

    • Can be used with various materials and components, including those for RF applications and high-speed signals.

  7. Cost-Effective for High Volumes:

    • While the initial setup may be more expensive, blind vias can reduce costs in mass production due to improved manufacturing efficiency.

  8. Facilitates Multi-Layer Designs:

    • Ideal for multi-layer PCBs where interconnectivity between non-adjacent layers is required.

  9. High Frequency Performance:

    • Suitable for high-frequency applications due to reduced parasitic capacitance and inductance.

  10. Compliance with Industry Standards:

    • Manufactured to meet stringent quality and safety standards, ensuring reliability in critical applications.

 

 

FAQ

Question 1: What is needed for a quotation?
Answer:
PCB: QTY, Gerber file, and Technical Requirements( material/surface finish treatment/copper thickness/board thickness,...)
PCBA: PCB information, BOM,(Testing documents...)

Q2: What file formats do you accept for production?
Answer:
PCB Gerber file
BOM list for PCB
Test method for PCBA

Q3: Are my files safe?
Answer:
Your files are held completely safe and secure. We protect the IP for our customers in the whole process. All documents from customers are never shared with any 3rd parties.

Q4: What is the shipment method?
Answer:
We can offer FedEx /DHL / TNT / UPS for shipment. Also, customer provided shipment method is acceptable.

Q5: What is the payment method?
Answer:
Telegraphic Transfer in advance (Advance TT, T/T), PayPal is acceptable.

​Product Description​

Specification:
PCB layers:1-42layers
PCB materials:CEM1, CEM3, Rogers, FR-4, High Tg FR-4, Aluminum Base, Halogen Free
PCB max. board size:620mm*1100mm
PCB certificate:RoHS Directive-Compliant
PCB Thickness:1.6 ±0.1mm
Out Layer Copper Thickness:0.5-5oz
Inner Layer Copper Thickness:0.5-4oz
PCB max. board thickness:6.0mm
Minimum Hole Size:0.20mm
Minimum Line Width/Space:3/3mil
Min. S/M Pitch:0.1mm(4mil)
Plate Thickness and Aperture Ratio :30:1
Minimum Hole Copper:20µm
Hole Dia. Tolerance(PTH):±0.075mm(3mil)
Hole dia. Tolerance(NPTH):±0.05mm (2mil)
Hole Position Deviation:±0.05mm (2mil)
Outline Tolerance:±0.05mm (2mil)
PCB solder mask:Black, white, yellow
PCB surface finished:HASL Leadfree,Immersion ENIG,Chem Tin,Flash Gold,OSP,Gold finger,Peelable,Immersion Silver
Legend:White
E-test:100% AOI, X-ray, Flying probe test.
Outline:Rout and Score/V-cut
Inspection Standard:IPC-A-610CCLASSII
Certificates:UL (E503048),ISO9001/ISO14001/IATF16949
Outgoing Reports:Final Inspection, E-test, Solderability Test, Micro Section and More
Product Tags: Multilayer IC Substrate PCB Board   Soft Gold IC Substrate PCB Board  
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