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IC Substrate Multilayer Rigid PCB MEMS Sensor Micro Electromechanical System

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Shenzhen Tecircuit Electronics Limited

City: shenzhen

Country/Region:china

Tel:86-0755-8487 -5025

Contact Person:
Mr.David Zeng View Contact Details

IC Substrate Multilayer Rigid PCB MEMS Sensor Micro Electromechanical System
Brand Name TECircuit
Model Number TEC0208
Certification UL,ISO 9001, ISO 14001, ISO 13485, ITAF 16949, ROHS,REACH. W
Place of Origin China
Minimum Order Quantity 1pcs for sample, 100pcs for bulk
Price USD 1.99 ~ USD9.99/pcs
Payment Terms L/C, D/A, D/P, T/T, Western Union, MoneyGram
Supply Ability 50000 pcs/month
Delivery Time 5-15 wotk days
Packaging Details Vacuum package+Carton box
Brand Shenzhen Tecircuit Electronics Co., Ltd
Product Type PCB,High frequency board,RIGID PCB,Rigid board,Flexible board,Rigid-Flex PCB,IC-Substrate,Metal Core
Item No. R0076
Service PCBA service
Detailed Product Description

Product Images

 

 

 

 

 

 

 

About TECircuit

 

Found: TECircuit has been operating since 2004.

Location: An electronics manufacturing service(EMS) provider located in Shenzhen China.

Item: Customizable EMS PCB, offers a full range of one-stop shop services.

Service: Printed Circuit Board (PCB)and Printed Circuit Board Assembly(PCBA), Flexible Printed Circuit Board(FPC), Components Sourcing, Box-Building, Testing.

Quality Assurance: UL,ISO 9001, ISO 14001, ISO 13485, ITAF 16949 andcomplied with ROHS and REACH.

Factory Pictures:
Company's own plant : 50,000 sqm; Employees : 930+; Monthly production capacity : 100,000 m2

 

Product Applications

  • Consumer Electronics:

    • Used in smartphones and tablets for motion sensing, orientation detection, and environmental sensing (temperature, humidity).

  • Automotive Systems:

    • Integrated into vehicles for applications such as airbag deployment sensors, tire pressure monitoring systems (TPMS), and stability control.

  • Medical Devices:

    • Employed in diagnostic and monitoring equipment, including wearable health devices that track vital signs and movements.

  • Industrial Automation:

    • Used in factory automation systems for pressure, temperature, and motion monitoring to enhance operational efficiency.

  • Smart Home Devices:

    • Integrated into smart appliances for environmental monitoring, security systems, and energy management.

  • Robotics:

    • Employed in robotic systems for navigation, positioning, and environmental interaction through various sensors.

  • Aerospace and Defense:

    • Used in inertial measurement units (IMUs) for navigation and guidance systems, ensuring precision in critical applications.

  • Gaming and Virtual Reality:

    • Integrated into gaming controllers and VR headsets for motion tracking and immersive experiences.

  • Environmental Monitoring:

    • Used in sensors that detect air quality, pollution levels, and other environmental parameters.

  • Agriculture:

    • Employed in precision agriculture for monitoring soil conditions, crop health, and environmental factors affecting yield.

 

Product Features 

  1. Miniaturization:

    • MEMS sensors are compact, allowing for integration into small devices without sacrificing performance.

  2. High Sensitivity:

    • Designed to detect minute changes in physical phenomena, providing accurate readings for various applications.

  3. Low Power Consumption:

    • Engineered for energy efficiency, making them suitable for battery-operated and portable devices.

  4. Robustness:

    • Built to withstand harsh environmental conditions, ensuring reliability in various applications, including automotive and industrial settings.

  5. High Precision and Accuracy:

    • Offers reliable measurements with low drift and high repeatability, essential for critical applications.

  6. Integration Capability:

    • Can be easily integrated with other electronic components, enhancing functionality in complex systems.

  7. Cost-Effectiveness:

    • Mass production techniques for MEMS devices reduce costs, making them accessible for a wide range of applications.

  8. Versatility:

    • MEMS sensors can be designed for various sensing modalities, including acceleration, pressure, temperature, and chemical detection.

  9. Real-Time Data Processing:

    • Capable of providing immediate feedback and data, essential for applications requiring real-time monitoring and control.

  10. Compliance with Industry Standards:

    • Manufactured to meet stringent safety and performance standards, ensuring reliability in critical applications.

 

 

FAQ

Question 1: What is needed for a quotation?
Answer:
PCB: QTY, Gerber file, and Technical Requirements( material/surface finish treatment/copper thickness/board thickness,...)
PCBA: PCB information, BOM,(Testing documents...)

Q2: What file formats do you accept for production?
Answer:
PCB Gerber file
BOM list for PCB
Test method for PCBA

Q3: Are my files safe?
Answer:
Your files are held completely safe and secure. We protect the IP for our customers in the whole process. All documents from customers are never shared with any 3rd parties.

Q4: What is the shipment method?
Answer:
We can offer FedEx /DHL / TNT / UPS for shipment. Also, customer provided shipment method is acceptable.

Q5: What is the payment method?
Answer:
Telegraphic Transfer in advance (Advance TT, T/T), PayPal is acceptable.

​Product Description​

Specification:
PCB layers:1-42layers
PCB materials:CEM1, CEM3, Rogers, FR-4, High Tg FR-4, Aluminum Base, Halogen Free
PCB max. board size:620mm*1100mm
PCB certificate:RoHS Directive-Compliant
PCB Thickness:1.6 ±0.1mm
Out Layer Copper Thickness:0.5-5oz
Inner Layer Copper Thickness:0.5-4oz
PCB max. board thickness:6.0mm
Minimum Hole Size:0.20mm
Minimum Line Width/Space:3/3mil
Min. S/M Pitch:0.1mm(4mil)
Plate Thickness and Aperture Ratio :30:1
Minimum Hole Copper:20µm
Hole Dia. Tolerance(PTH):±0.075mm(3mil)
Hole dia. Tolerance(NPTH):±0.05mm (2mil)
Hole Position Deviation:±0.05mm (2mil)
Outline Tolerance:±0.05mm (2mil)
PCB solder mask:Black, white, yellow
PCB surface finished:HASL Leadfree,Immersion ENIG,Chem Tin,Flash Gold,OSP,Gold finger,Peelable,Immersion Silver
Legend:White
E-test:100% AOI, X-ray, Flying probe test.
Outline:Rout and Score/V-cut
Inspection Standard:IPC-A-610CCLASSII
Certificates:UL (E503048),ISO9001/ISO14001/IATF16949
Outgoing Reports:Final Inspection, E-test, Solderability Test, Micro Section and More
Product Tags: IC Substrate Multilayer Rigid PCB   Electromechanical System Rigid PCB  
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