Air-to-Air Thermal Shock Chambers: Fast Transfer, Component StressOur Air-to-Air Thermal Shock Chambers are engineered for exceptionally rapid and precise temperature
cycling, making them the ideal solution for subjecting components
and small assemblies to extreme thermal stress. Featuring fast air-to-air transfer between physically separated hot and cold zones, these chambers
efficiently uncover design flaws, material fatigue, and potential
failure points caused by rapid temperature changes. Essential for
industries where component reliability under thermal shock is
paramount, our chambers accelerate validation and ensure the
robustness of your critical parts. Key Features- Air-to-Air Technology: Utilizes a swift, automated mechanism to transfer the test
specimen directly between pre-conditioned hot and cold air
environments, ensuring minimal thermal lag and maximum shock.
- Fast Transfer Times: Achieves near-instantaneous transfer of samples (typically within
seconds), maximizing the severity of thermal shock and overall test
efficiency.
- Rapid Temperature Change Rates: Capable of achieving extremely fast temperature transitions
between hot and cold zones, accurately simulating the most severe
thermal stresses.
- Precise Temperature Uniformity & Control: Advanced airflow and powerful conditioning systems ensure
excellent temperature uniformity and stability within each zone,
crucial for accurate and repeatable test results.
- Two-Zone (or Three-Zone) Design: Features physically separated hot and cold (and optionally
ambient) chambers for continuous, independent temperature
conditioning.
- Robust Stainless Steel Interior: Constructed with high-grade stainless steel for exceptional
durability, corrosion resistance, and easy cleaning, ensuring
long-term reliability.
- Comprehensive Data Logging: Continuously records temperature profiles, transfer times, and
test cycles, providing a complete audit trail for analysis and
compliance.
- User-Friendly Interface: Intuitive touchscreen controls and software simplify test
programming, real-time monitoring, and data export.
- Energy Efficiency: Optimized refrigeration and heating systems, combined with
superior insulation, ensure efficient operation and lower running
costs.
- Safety Features: Equipped with multiple interlocks, over-temperature protection,
and alarm systems to safeguard both the equipment and the test
samples.
Applications- Electronics & Semiconductors: Thermal shock testing of integrated circuits, PCBs, sensors,
connectors, and power modules to identify solder joint failures,
delamination, and material fatigue.
- Automotive Components: Evaluation of ECUs, sensors, lighting, and small electronic
modules for thermal stress resistance in harsh vehicle
environments.
- Aerospace & Defense: Qualification of avionics, critical sensors, and small components
for rapid thermal changes encountered in high-altitude or space
applications.
- Medical Devices: Durability testing of sensitive medical components exposed to
rapid temperature variations during operation or sterilization.
- Materials Science: Assessing the thermal expansion, contraction, and fatigue
properties of new materials for component applications.
- Optoelectronics: Testing stability of optical components, lasers, and detectors
under severe thermal gradients.
Benefits- Accelerated Component Stress Testing: Quickly reveals latent defects and potential failure modes in
critical components, significantly shortening development cycles
and time-to-market.
- Enhanced Component Reliability: Guarantees that individual components and small assemblies can
withstand severe and rapid thermal fluctuations.
- Accurate Simulation: Precisely replicates real-world rapid temperature changes,
providing high confidence in component performance.
- Increased Efficiency: Fast transfer times and automated cycling maximize testing
throughput and reduce manual intervention.
- Reduced Rework & Warranty Costs: Proactive identification of weaknesses at the component level
prevents costly field failures in final products.
- Reliable Compliance Data: Provides accurate, repeatable results essential for meeting
industry standards and certifications.
SpecificationsModel | TSC-49-3 | TSC-80-3 | TSC-150-3 | TSC-216-3 | TSC-512-3 | TSC-1000-3 | Inside dimension(W x D x H) cm | 40 x 35 x 35 | 50 x 40 x 40 | 65x 50 x 50 | 60 x 60 x 60 | 80 x 80 x 80 | 100 x 100 x 100 | Outside dimension(W x D x H)cm | 128x 190 x 167 | 138 x 196 x 172 | 149 x 192 x 200 | 158 x 220 x 195 | 180 x 240 x 210 | 220 x 240x 220 | Internal material | #304 Stainless Steel | External material | Powder coated #304 Stainless Steel | High temperature range | 60 ℃ ~ 200 ℃ | Low temperature range | 0 ℃ ~ -70 ℃ | Test temperature range | 60 ℃ ~ 180 ℃ / 0 ℃ ~ -70 ℃ | Temperature recovery time | 1-5min | Temperature stability ℃ | ±2 | Cylinder switching time | 10s | High temperature ℃ | 150 | 150 | 150 | 150 | 150 | 150 | Heating time (min) | 20 | 30 | 30 | 30 | 30 | 30 | Low temperature | -40, -50, -65 | -40, -50, -65 | -40, -50, -65 | -40, -50, -65 | -40, -50, -65 | -40, -50, -65 | Cooling time (min) | 40, 50, 60 | 40, 50, 60 | 40, 50, 60 | 40, 50, 60 | 40, 50, 60 | 40, 50, 60 | Air circulation system | Mechanical convection system | Cooling system | Imported compressor, fin evaporator, gas condenser | Heating system | Fin heating system | Humidification system | Steam Generator | Humidification water supply | Reservoir, Sensor-controller solenoid valve, recovery-recycle
system | Controller | Touch panel | Electrical power requirements | 3 phase 380V 50/60 Hz | Safety device | Circuit system load protection, compressor load protection, control
system load protection, humidifier load protection, overtemperature
load protection, fault warning light |
Ready to push the thermal limits of your critical components?
Contact our experts today to discuss your requirements for an Air-to-Air Thermal Shock Chamber and ensure the ultimate resilience of your products.
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