411 - 420 of 827
thermal gap filler yellow
Selling leads
|
1.75mmT Heat Snk Pad Easy Release Construction for Display Card The TIF170-30-06UF use a special process, with silicone as the base material, adding ...
2026-07-09 00:40:03
|
|
Dielectric Constant 5.0 MHz Conductive Pads Easy Release Construction for LED Controller The TIF1140-30-06UF thermal silicone pad is a product with ...
2026-07-09 00:40:03
|
|
Specific Gravity 2.2 g/cc Silicone Pads Soft and Compressible for Low Stress Applications for CPU The TIF160-10UF use a special process, with silicone ...
2026-07-09 00:40:03
|
|
1.0mmT Soft and Compressible for Low Stress Applications Silicone Pads for LED TV The TIF140-05UF thermal silicone pad is a product with both ...
2026-07-09 00:40:03
|
|
1.0X10^12 Ohm-cm Moldability for Complex Parts Heat Sink Pad for Handheld Portable Electronics The TIF1140-05UF thermal silicone pad is a product with ...
2026-07-09 00:40:03
|
|
75 Shore 00 Easy Release Construction Heat Sink Pad for MD LED Module The TIF1160-20-10UF use a special process, with silicone as the base material, ...
2026-07-09 00:40:03
|
|
...Thermal GAP PAD Materials for Computer CPU/GPU Cooling Company Profile Ziitek Electronic Material and Technology Ltd. is a R&D and production ...
2026-07-09 00:40:03
|
|
...Thermal GAP PAD Materials For AI Processors AI Servers TIF®100-50-11U Series is an ultra-soft thermal interface material designed specifically to ...
2026-07-09 00:40:03
|
|
-40 to 160℃ UL Recognized Silicone Pads for Heat Pipe Thermal Solutions The TIF1100-20-10UF is recommended for applications that require a minimum ...
2026-07-09 00:40:03
|
|
2.5mmt Low Cost and High Durability Thermal Pad for Power Supply The TIF1100-30-06UF is recommended for applications that require a minimum amount of ...
2026-07-09 00:40:03
|