Specific Gravity 2.2 G/Cc Thermal Gap Pad Silicone Soft Compressible
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Specific Gravity 2.2 g/cc Silicone Pads Soft and Compressible for Low Stress Applications for CPU
The TIF160-10UF use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
TIF100-10UF Datasheet-REV02.pdf
Features > Good thermal conductive: 1.5 W/mK >Thickness: 1.5mmT >hardness:75 shore 00 >Colour: gray >Good thermal conductive
Applications >LED Power Supply >LED Controller >LED Ceilinglamp >Monitoring the Power Box >AD-DC Power Adapters >Rainproof LED Power
Company Profile With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.
Packaging Details & Lead time
The packaging of thermal pad 1.with PET film or foam-for protection 2. use Paper Card To Separate Each Layer 3. export carton inside and outside 4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000 Est. Time(days): To be negotiated
FAQ: Q: How do I place an order? A:1. Click the "Sent messages" button to continue with the process. 2. Fill out the message form by entering a subject line, and message to us. This message should include any questions you might have about the products as well as your purchase requests. 3. Click the "Send" button when you are finished to complete the process and send your message to us. 4. We will reply you as soon as possible with Email or online. |
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| Product Tags: rohs compliant thermal gap pad compressible thermal gap pad 2.2 g/cc thermal interface pad | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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