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5.0mmT Electrically Isolating Conductive Pads for RDRAM Memory Modules The TIF2200-20-02ES is not only designed to take advantage of the gap heat ...
2025-07-31 00:03:55
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2.5mmT Moldability for Complex Parts Gray Conductive Pads for CPU The TIF7100M is not only designed to take advantage of the gap heat transfer, to ...
2025-07-31 00:03:55
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1.0X10^12 Ohm-cm RoHS Compliant Conductive Pads for Telecommunication Hardware The TIF720M is recommended for applications that require a minimum ...
2025-07-31 00:03:55
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...Conductive Interface Material Gap Filler Battery Elements Thermal Insulation Materials TIS®807-09-01 Series of products are highly efficient ...
2025-07-31 00:03:55
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...Conductive Insulator For Power Semiconductors The TIS®809-16-02 Series of products are highly efficient insulating products and they also have ...
2025-07-31 00:03:55
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...conductivity grey soft 0.3mmT pads 1w conductivity for closed cell heat sinking The TIS™112-01 products are the high-efficiency insulation ones ...
2024-12-09 18:01:44
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...Conductivity Thermally Insulating Materials For RDRAM Memory Modules The TIF8100 use a special process, with silicone as the base material, adding ...
2024-12-09 18:19:42
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The TIF5120S thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or ...
2025-07-31 00:03:55
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...Pad For Lndustrial Equipment TS-TIF®100C 8045-11 series is a silicone-based thermal material designed to fill the gaps between heat-generating ...
2025-07-31 00:03:55
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... cooling plates or metal bases. lts flexibility and elasticity make it ideal for covering highly uneven surfaces. With excellent thermal conductivi...
2025-07-31 00:03:55
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