5.0mmT Electrically Isolating Conductive Pads For RDRAM Memory Modules
|
|
5.0mmT Electrically Isolating Conductive Pads for RDRAM Memory Modules
The TIF2200-20-02ES is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.
TIF200-20-02ES-Series-Datasheet.pdf
Features > Good thermal conductive: 2.0 W/mK >Thickness: 5.0mmT >hardness:10 shore 00 >Colour: Pink/White >Electrically isolating
Applications >cooling components to the chassis of frame >High speed mass storage drives >Heat Sinking Housing at LED-lit BLU in LCD >LED TV and LED-lit lamps >RDRAM memory modules >Micro heat pipe thermal solutions
Company Profile Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.
Certifications: ISO9001:2015 ISO14001: 2004 IATF16949:2016 IECQ QC 080000:2017 UL
FAQ: Q: How do I request customized samples? A: To request samples, you can leave us message on website, or just contact us by send email or call us. Q: What's the thermal conductivity test method given on the data sheet ? A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity. |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Product Tags: Electrically Isolating Conductive Pads RDRAM Memory Modules Conductive Pads 5.0mm Thickness Thermal Gap Pad | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Sticky Soft Heatsink Cooling Gap Filler Thermal Conductive Silicone Pad |
|
Thermal Conductivity 8.0W/m-K Heat Sink Thermal Pad for Electronic Devices CPU PC GPU |
|
Cooling Thermal Conductive Silicone Gap Pad Filler For Laptop |
|
2.5mmT Thickness 8W/mk Thermal Silicone Pad for AI Thermal Interface Material |
|
Thermal Interface Material Pads Thermal Silicone Pad For New Energy Vehicle Batteries PCB |
|
Material Specific Thermal Conductivity Thermal Pad For Audio Video Devices |