5W / MK Conductivity Thermally Insulating Materials For RDRAM Memory Modules
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5W / MK Conductivity Thermally Insulating Materials For RDRAM Memory Modules
The TIF8100 use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
> Perfect thermal conducting > Naturally tacky needing no further adhesive
coating
> Cooling components to the chassis of frame > Telecommunication hardware > RDRAM memory modules > LED TV and LED-lit lamps > Automotive engine control units > High speed mass storage drives > Micro heat pipe thermal solutions
Standard Thicknesses: 0.100" (2.54mm) Standard Sheets Sizes: 8" x 16"(203mm x 406mm) 16" x 18"(406mm x 457mm) TIF™ series Individual die cut shapes can be supplied. Certifications: ISO9001:2015 ISO14001: 2004 IATF16949:2016 IECQ QC 080000:2017 UL Reinforcement: TIF™ series sheets type can add with fiberglass reinforced. |
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| Product Tags: thermally conductive filler thermal conductivity silicone Thermal Gap Filler 2.5mmT | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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