5W / MK Conductivity Thermally Insulating Materials For RDRAM Memory Modules

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Dongguan Ziitek Electronic Materials & Technology Ltd.

City: dongguan

Province/State:guangdong

Country/Region:china

Tel:86--18153789196

Contact Person:
Ms.Dana Dai View Contact Details

5W / MK Conductivity Thermally Insulating Materials For RDRAM Memory Modules

Brand Name	ZIITEK
Model Number	TIF8100
Certification	UL and RoHs
Place of Origin	China
Minimum Order Quantity	1000pcs
Price	negotiation
Supply Ability	10000/day
Delivery Time	3-5work days
Packaging Details	1000pcs/bag
Application	RDRAM memory modules
Color	gray
Thickness	2.5mmT
Feature	thermal conducting
heat conducctivity	5W/mK

Detailed Product Description

5W / MK Conductivity Thermally Insulating Materials For RDRAM Memory Modules

The TIF8100 use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.

Features:

> Perfect thermal conducting
> Good thermal conductive: 5 W/mK

> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Thcikness: 2.5mmT

Applications:

> Cooling components to the chassis of frame

> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment

> RDRAM memory modules

> LED TV and LED-lit lamps

> Automotive engine control units

> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD

> Micro heat pipe thermal solutions

Typical Properties of TIF™8100
Color	gray	Visual	Composite Thickness	hermalImpedance @10psi (℃-in²/W)
Construction & Compostion	Ceramic filled silicone elastomer	***	10mils / 0.254 mm	0.21
			20mils / 0.508 mm	0.27
Specific Gravity	2.69 g /cc	ASTM D297	30mils / 0.762 mm	0.39
			40mils / 1.016 mm	0.43
Heat Capacity	1 l /g-K	ASTM C351	50mils / 1.270 mm	0.50
			60mils / 1.524 mm	0.58
Hardness	45 Shore 00	ASTM 2240	70mils / 1.778 mm	0.65
			80mils / 2.032 mm	0.76
Tensile Strength	40 psi	ASTM D412	90mils / 2.286 mm	0.85
			100mils / 2.540 mm	0.94
Continuos Use Temp	-40 to 160℃	***	110mils / 2.794 mm	1.00
			120mils / 3.048 mm	1.07
Dielectric Breakdown Voltage	>1500～>5500 VAC	ASTM D149	130mils / 3.302mm	1.16
			140mils / 3.556 mm	1.25
Dielectric Constant	5.5 MHz	ASTM D150	150mils / 3.810 mm	1.31
			160mils / 4.064 mm	1.38
Volume Resistivity	6.3X1012Ohm-meter	ASTM D257	170mils / 4.318 mm	1.43
			180mils / 4.572 mm	1.50
Fire rating	94 V-0	equivalent UL	190mils / 4.826 mm	1.60
			200mils / 5.080 mm	1.72
Thermal conductivity	5 W/m-K	ASTM D5470	Visua l/ ASTM D751	ASTM D5470

Standard Thicknesses:

0.100" (2.54mm)

Standard Sheets Sizes:

8" x 16"(203mm x 406mm) 16" x 18"(406mm x 457mm)
TIF™ series Individual die cut shapes can be supplied.

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

Reinforcement:

TIF™ series sheets type can add with fiberglass reinforced.

Product Tags: thermally conductive filler thermal conductivity silicone Thermal Gap Filler 2.5mmT

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5W / MK Conductivity Thermally Insulating Materials For RDRAM Memory Modules

5W / MK Conductivity Thermally Insulating Materials For RDRAM Memory Modules

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