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cpu thermal conductive gap pad
Selling leads
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... the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to ...
2025-08-02 00:03:40
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4.0mmT new developed thermal conductive pad,Fire rating UL94 V0 For Heat pipe thermal solutions The TIF1160-05ES is a highly compliant Gap Pad ...
2025-08-02 00:03:40
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...pads for power supply,3.15g/cm3 The TIF1120-40-11US use a special process, with silicone as the base material, adding thermal conductive powder and ...
2025-08-02 00:03:40
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...Pads for Memory Modules The TIF140-30-02US use a special process, with silicone as the base material, adding thermal conductive powder and flame ...
2025-08-02 00:03:40
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... and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between ...
2025-08-02 00:03:40
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... together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and ...
2025-08-02 00:03:40
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...Pad for MD LED Module The TIF1160-20-10UF use a special process, with silicone as the base material, adding thermal conductive powder and flame ...
2025-08-02 00:03:40
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...Thermally Conductive Gel Thermal Gap Filler For Micro Heat Pipe Product description TIF®040-12 is a soft silicone gel-based gap filer pad, ...
2025-08-01 00:13:01
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... the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to ...
2025-08-02 00:03:40
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... the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to ...
2025-08-02 00:03:40
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