1.0mmt Soft Compressible Gap Pad Thermal Conductivity For Memory Modules
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1.0mmT Soft and compressible for Low Stress Applications Silicone Pads for Memory Modules
The TIF140-30-02US use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
TIF100-30-02US-Datasheet-REV02.pdf
Features > Good thermal conductive: 3.0 W/mK >Thickness:1.0mmT >hardness:20 shore 00 >Colour: gray >Easy release construction >Electrically isolating >High durability
Applications >mainboard/mother board >notebook >power supply >Heat pipe thermal solutions >Memory Modules >Mass storage devices
Company Profile Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.
Packaging Details & Lead time
The packaging of thermal pad 1.with PET film or foam-for protection 2. use Paper Card To Separate Each Layer 3. export carton inside and outside 4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000 Est. Time(days): To be negotiated
FAQ: Q: How do I place an order? A:1. Click the "Sent messages" button to continue with the process. 2. Fill out the message form by entering a subject line, and message to us. This message should include any questions you might have about the products as well as your purchase requests. 3. Click the "Send" button when you are finished to complete the process and send your message to us 4. We will reply you as soon as possible with Email or online |
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| Product Tags: 1.0mmt gap pad thermal conductivity memory modules gap pad thermal conductivity memory modules thermal gap filler material | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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