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memory modules thermal gap filler material
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Telecommunication Hardware 3.0W/m-K Thermal Gap Fillers Materials With High Thermal Conductivity 45 shore00 The TIF100-30-02US thermally conductive ...
2024-12-09 17:49:12
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...Gap Fillers Materials With High Thermal Conductivity Company Profile Ziitek Electronic Material and Technology Ltd. is dedicated to developing ...
2024-12-09 11:03:26
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new type Moldability for complex parts UL recognized 3.0 W/mK thermal conductive pad for notebook,2.5mmT The TIF1100-30-06US use a special process, ...
2025-07-11 00:05:01
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... It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at ...
2025-07-11 00:05:02
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Thermal Conductivity Silicone Thermal Gap Filler Pad Thermal Pad For Heatsink CPU GPU SSD IC LED Memory Modules TIF®100C 10075-11 series is a silicone...
2025-07-11 00:05:02
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...Thermal Gap Filler , Heat Conductive Materials For Memory Modules Company Profile Ziitek company is a high-tech enterprise which dedicated to the R...
2025-07-11 00:05:02
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... the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to ...
2025-07-11 00:05:01
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...flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the ...
2025-07-11 00:05:01
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Semiconductor automated test equipment (ATE) Ziitek Thermal Gap Filler in MB application TIF100-02S The TIF100-02S thermally conductive interface ...
2025-07-11 00:05:02
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Thermal Gap Filler in Semiconductor automated test equipment (ATE) Applications: > Cooling components to the chassis of frame > High speed mass ...
2025-07-11 00:05:02
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