431 - 440 of 686
cpu conductive pad
Selling leads
|
...Pad for Notebook The TIF160-05UF use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant ...
2025-08-02 00:03:40
|
|
Good Thermal Conductive TIF1200-05UF Heat Sink Pad for Automotive Electronics The TIF1200-05UF is recommended for applications that require a minimum ...
2025-08-02 00:03:40
|
|
...Pad for MD LED Module The TIF1160-20-10UF use a special process, with silicone as the base material, adding thermal conductive powder and flame ...
2025-08-02 00:03:40
|
|
...Pad for IT Infrastructure The TIF140N-40-10F use a special process, with silicone as the base material, adding thermal conductive powder and flame ...
2025-08-02 00:03:40
|
|
Good Thermal Conductive TIF180N-40-10F Heat Sink Pad for LED PanelLight The TIF180N-40-10F is recommended for applications that require a minimum ...
2025-08-02 00:03:40
|
|
... the thermal resistance between the heat source and the heat sink. TIF100N-40-10F-Specification-sheet.pdf Features > Good thermal conductive: 4.0 W...
2025-08-02 00:03:40
|
|
...Pad for Notebook The TIF1180N-50-10F use a special process, with silicone as the base material, adding thermal conductive powder and flame ...
2025-08-02 00:03:40
|
|
... the thermal resistance between the heat source and the heat sink. TIF200-20-02ES-Series-Datasheet.pdf Features > Good thermal conductive:
2025-08-02 00:03:40
|
|
...Pads for Handheld Portable Electronics The TIF2180-20-02ES use a special process, with silicone as the base material, adding thermal conductive ...
2025-08-02 00:03:40
|
|
...Pad for SMD LED Module The TIF780M use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant ...
2025-08-02 00:03:40
|