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AP12N10D Power Switch Transistor , Original Silicon Power Transistor

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Shenzhen Hua Xuan Yang Electronics Co.,Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:+86--13417075252

Contact Person:
Mr.David Lee
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AP12N10D Power Switch Transistor , Original Silicon Power Transistor

Brand Name Hua Xuan Yang
Model Number AP12N10D
Certification RoHS、SGS
Place of Origin ShenZhen China
Minimum Order Quantity Negotiation
Price Negotiated
Payment Terms L/C T/T Western Union
Supply Ability 18,000,000PCS / Per Day
Delivery Time 1 - 2 Weeks
Packaging Details Boxed
Product name Power Switch Transistor
Model AP12N10D
Pack TO-252
Marking AP12N10D
VDSDrain-Source Voltage 100V
VGSGate-Sou rce Voltage ±20A
Detailed Product Description

AP12N10D Power Switch Transistor , Original Silicon Power Transistor

 

General Description:

 

The AP12N10D uses advanced trench technology
to provide excellent RDS(ON), low gate charge and
operation with gate voltages as low as 4.5V. This
device is suitable for use as a
Battery protection or in other Switching application.

 

General Features

 

VDS = 100V ID = 5A
RDS(ON) < 140mΩ @ VGS=4.5V

 

 

Application

 

Battery protection
Load switch
Uninterruptible power supply

 

Package Marking and Ordering Information

 

Product IDPackMarkingQty(PCS)
AP12N10DTO-252AP12N10D3000

 

Absolute Maximum Ratings at Tj=25℃ unless otherwise noted

 

ParameterSymbolValueUnit
Drain source voltageVDS100V
Gate source voltageVGS±20V
Continuous drain current , TC=25 ℃ID12A
Pulsed drain current , T =25 ℃ID, pulse24A
Power dissipation , T C=25 ℃

P

D

17W
Single pulsed avalanche energy 5)EAS1.2mJ
Operation and storage temperatureTstg,Tj-55 to 150
Thermal resistance, junction-caseRθJC7.4℃/ W
Thermal resistance, junction-ambient4)RθJA62℃/ W

 

Electrical Characteristics at Tj=25 ℃ unless otherwise specified

 

SymbolParameterTest conditionMin.Typ.Max.Unit
BVDSSDrain-source breakdown voltageV =0 V, ID=250 μA100  V
VGS(th)Gate threshold voltageV =V , ID=250 μA1.21.52.5V
RDS(ON)Drain-source on-state resistanceVGS=10 V, ID=5 A 110140
RDS(ON)Drain-source on-state resistanceV =4.5 V, ID=3 A 140180

 

IGSS

 

Gate-source leakage current

V =20 V  100

 

nA

V =-20 V  -100
IDSSDrain-source leakage currentVDS=100 V, VGS=0 V  1uA
CissInput capacitanceV =0 V, 206.1 pF
CossOutput capacitance 28.9 pF
CrssReverse transfer capacitance 1.4 pF
td(on)Turn-on delay time

VGS=10 V,

VDS=50 V,

 14.7 ns
trRise time 3.5 ns
td(off)Turn-off delay time 20.9 ns

t

f

Fall time 2.7 ns
QgTotal gate charge  4.3 nC
QgsGate-source charge 1.5 nC
QgdGate-drain charge 1.1 nC
VplateauGate plateau voltage 5.0 V
ISDiode forward current

 

VGS<Vth

  7

 

A

ISPPulsed source current  21
VSDDiode forward voltageIS=7 A, VGS=0 V  1.0V

t

rr

Reverse recovery time  32.1 ns
QrrReverse recovery charge 39.4 nC
IrrmPeak reverse recovery current 2.1 A
SymbolParameterTest conditionMin.Typ.Max.Unit
BVDSSDrain-source breakdown voltageV =0 V, ID=250 μA100  V
VGS(th)Gate threshold voltageV =V , ID=250 μA1.21.52.5V
RDS(ON)Drain-source on-state resistanceVGS=10 V, ID=5 A 110140
RDS(ON)Drain-source on-state resistanceV =4.5 V, ID=3 A 140180

 

IGSS

 

Gate-source leakage current

V =20 V  100

 

nA

V =-20 V  -100
IDSSDrain-source leakage currentVDS=100 V, VGS=0 V  1uA
CissInput capacitanceV =0 V, 206.1 pF
CossOutput capacitance 28.9 pF
CrssReverse transfer capacitance 1.4 pF
td(on)Turn-on delay time

VGS=10 V,

VDS=50 V,

 14.7 ns
trRise time 3.5 ns
td(off)Turn-off delay time 20.9 ns

t

f

Fall time 2.7 ns
QgTotal gate chargeID=5 A,
VDS=50 V,
VGS=10 V
 4.3 nC
QgsGate-source charge 1.5 nC
QgdGate-drain charge 1.1 nC
VplateauGate plateau voltage 5.0 V
ISDiode forward current

 

VGS<Vth

  7

 

A

ISPPulsed source current  21
VSDDiode forward voltageIS=7 A, VGS=0 V  1.0V

t

rr

Reverse recovery timeIS=5 A, di/dt=100
A/μs
 32.1 ns
QrrReverse recovery charge 39.4 nC
IrrmPeak reverse recovery current 2.1 A

 

Attention

 

1, Any and all APM Microelectronics products described or contained herein do not have specifications that can handle applications that require extremely high levels of reliability, such as life support systems, aircraft's control systems, or other applications whose failure can be reasonably expected to result in serious physical and/or material damage. Consult with your APM Microelectronics representative nearest you before using any APM Microelectronics products described or contained herein in such applications.

2, APM Microelectronics assumes no responsibility for equipment failures that result from using products at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or other parameters) listed in products specifications of any and all APM Microelectronics products described or contained herein.

3, Specifications of any and all APM Microelectronics products described or contained here instipulate the performance, characteristics, and functions of the described products in the independent state, and are not guarantees of the performance, characteristics, and functions of the described products as mounted in the customer’s products or equipment. To verify symptoms and states that cannot be evaluated in an independent device, the customer should always evaluate and test devices mounted in the customer’s products or equipment.

4, APM Microelectronics Semiconductor CO., LTD. strives to supply high quality high reliability products. However, any and all semiconductor products fail with some probability. It is possible that these probabilistic failures could give rise to accidents or events that could endanger human lives that could give rise to smoke or fire, or that could cause damage to other property. Whendesigning equipment, adopt safety measures so that these kinds of accidents or events cannot occur. Such measures include but are not limited to protective circuits and error prevention circuits for safe design, redundant design,and structural design.

5,In the event that any or all APM Microelectronics products(including technical data, services) described or contained herein are controlled under any of applicable local export control laws and regulations, such products must not be exported without obtaining the export license from the authorities concerned in accordance with the above law.

6, No part of this publication may be reproduced or transmitted in any form or by any means,electronic or mechanical, including photocopying and recording, or any information storage or retrieval system, or otherwise, without the prior written permission of APM Microelectronics Semiconductor CO., LTD.

7, Information (including circuit diagrams and circuit parameters) herein is for example only; it is not guaranteed for volume production. APM Microelectronics believes information herein is accurate and reliable, but no guarantees are made or implied regarding its use or any infringements of intellectual property rights or other rights of third parties.

8, Any and all information described or contained herein are subject to change without notice due to product/technology improvement,etc. When designing equipment, refer to the "Delivery Specification" for the APM Microelectronics product that you Intend to use.

 

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