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wafer precision dicing machine
Selling leads
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8inch/6inch/5inch/ 2inch /3inch 4inch /5inch C-axis/ a-axis/ r-axis/ m-axis 6"/6inch dia150mm C-plane Sapphire SSP/DSP wafers with 650um/1000um ...
2025-05-06 20:38:48
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SICOI Real-Time Control System 99.9% Algorithm Accuracy For Robotics & CNC Machines Introduction Silicon Carbide on Insulator (SiCOI) thin films ...
2025-06-23 17:12:57
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... Aluminum Garnet Wafer Product Type: Nd,Ce: YAG(neodymium-doped and cerium Yttrium aluminum garnet) laser rod is the ideal working material for ...
2025-07-16 00:09:37
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Product Introduction Microjet laser technology equipment is a combination of laser and high-speed water jet advanced processing technology, its core ...
2025-05-06 20:43:56
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Product Overview This ceramic disc cleaning & waxing integrated machine combines one ceramic disc cleaner with dual ceramic disc mounters, designed ...
2025-05-13 05:30:32
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... laser technology. It overcomes the limitations of traditional processes in material adaptability, machining precision, and efficiency. The ...
2025-05-06 20:43:49
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... and efficiency, this machine caters to diverse industrial needs, offering two configurations to handle workpieces ranging from 4"-8" (0200 mm) ...
2025-05-13 05:30:24
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...precision laser drilling machine achieves the smallest focused laser spot through beam expansion and focusing and utilizes a control system to ...
2025-07-16 00:09:37
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...precision ball screws are adopted for transmission, guaranteeing superior accuracy. High-grade gray cast iron castings are utilized, offering ...
2025-07-16 00:09:37
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...Machine for 4, 6, 8, and 10-inch SiC Cutting Speed: 0.3 mm/min (average) SiC Wire Saw Cutting Machine Abstract The SiC Wire Saw Cutting Machine by ...
2025-05-06 20:43:53
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