New Material Copper Sputtering Target With 99.9999% Ultra High Purity
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Copper Sputtering Target Ultra high purity 99.999%, 99.9999%6N ultra-high purity electrolytic copper is mainly used in the production of sputtering target, evaporation film and anode materials for integrated circuits.
Purity: 99.999% ~ 99.9999% For precise control of impurity content, Ag content can be controlled below 0.1ppm and s content below 0.02ppm
The content of gas elements (C, O, N, H) is less than 1ppm Main uses: 6N copper has some properties similar to gold, good conductivity, ductility, corrosion resistance and surface performance, and low softening temperature. As a new kind of material, high-purity copper is not only used in the preparation of high-purity analytical standard test materials, various connecting wires for electronic industry, bonding wires for electronic packaging, high-quality audio wires and integrated circuits, sputtering targets for liquid crystal display and ion coating, but also an indispensable and precious material in the atomic energy, rocket, missile, aviation, aerospace and metallurgical industries . As a new material, ultra pure copper has been paid more and more attention. In addition to the preparation of high-purity analytical standard test materials, various connecting wires for electronic industry, bonding wires for electronic packaging, high-quality audio wires and integrated circuits, sputtering targets and ion coating for liquid crystal display, high-quality audio circuits and other high-tech fields, high-purity copper is also used in atomic energy, rockets, missiles, aviation, space navigation and other fields Precious materials are indispensable in metallurgical industry. With the development of high and new technology and the need of strategic materials, high-purity metals have higher and higher requirements for purity. The preparation and application of high-purity and ultra-high-purity metals in modern materials science and engineering are new and growing fields.
Copper Sputtering Target 99.9999% , Copper Sputtering Target 99.999% are available in varying sizes Sizes:
Plate sputtering targets:
Thickness: 0.04 to 1.40" (1.0 to 35mm). Width up to 20"(50 to 500mm). Length: 3.9" to 6.56 feet( 100-2000mm) other sizes as requested. Cylinder sputtering targets:
3.94 Dia. x 1.58"(100 Dia. x 40mm) 2.56 Dia. x 1.58" (65 Dia. x 40mm) or 63*32mm other sizes as requested.
Tube sputtering targets:
2.76 OD x 0.28 WT x 39.4”L (70 OD x 7 WT x 1000mm L) 3.46 OD x 0.39 WT x 48.4”L (88 OD x 10 WT x 1230mm L) other sizes as requested.
Advantage:
1. Purity: 99.99% ~ 99.9999% 2. High density, no defects inside, even grains and smooth surface 3. Unique melting and casting pollution control process 4. It can meet the needs of customized alloy 5. Unique homogenization control technology of added elements 6. Unified microstructure control
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Product Tags: Sputtering Target With 99.9999% Ultra High Purity Copper Sputtering Target HIP Pressing Copper Sputtering Target |
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