TR Subassembly Hermetic Packages

Main performance parameters

Application fields: DCDC power supply, filter, modulator
Lead welding method: tin welding, gold wire bonding
Nickel layer thickness: >3μm
Gold layer thickness:> 0.45μm
Hermeticity: leak rate ≤1x10^-3Pa.cm³/s (He)
Insulation resistance: ≥1000MΩ (DC500V)
material:
Base: Kovar alloy, iron-nickel alloy, copper
Ring frame: Kovar alloy, steel
Lead: Kovar alloy, iron-nickel alloy, copper core composite
Cover plate: Kovar alloy, iron-nickel alloy, steel
Insulator: DM308 or similar, iron sealed glass beads, ceramic
Sealing process and technology: parallel seam welding, laser welding, tin sealing welding, stored energy welding