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Fr-4 6 Layer Hdi Pcb Manufacturing Service For Communications

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Beijing Haina Lean Technology Co., Ltd

City: beijing

Province/State:beijing

Country/Region:china

Tel:86--13722988404

Contact Person:
Miss.Marina
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Fr-4 6 Layer Hdi Pcb Manufacturing Service For Communications

Brand Name HNL-PCBA
Model Number PCB Assembly 012
Certification ISO9001,IS16949, ISO14001,ROHS , UL, IPC-A , UL, QC080000
Place of Origin CHINA
Minimum Order Quantity 1 PC
Price Negotiable
Payment Terms T/T, Western Union, L/C, MoneyGram
Supply Ability 10,000,000 Point /Day
Delivery Time 1-7days
Packaging Details ESD packaging with carton box
Product name FR-4 8 Layer HDI PCB Manufacturing Service For Communications
Material FR-4/Normal Tg/High Tg/Low Dk/HF FR4/PTEE/PI
Copper thickness 1oz ,2oz 3oz 4oz 5oz 6oz
Min. line spacing 0.030mm,0.05mm
Min. hole size 0.05mm, 0.1mm, 0.25mm, 0.1mm/4mil, 4mil, 0.02
Usage communications, industrial control, computer applications, aerospace, military, medical,
Board thickness 0.3mm,,,1.6mm,,,3.5mm
solder mask Green. Black. Red. Yellow. White. Blue etc.; custom
Type buried vias and through vias
Surface Finishing ENEPING /ENIG /HASL /FINGER GOLD/IMMERSION TIN/SELECTIVE THICK GOLD
Detailed Product Description

Green High-End HDI Printed Circuit Board For Automotive Electronics

HDI PCB Board Introduction

 

Advantages of HDI circuit board 
1. It can reduce the cost of PCB: when the density of the PCB increases beyond the eight-layer board, it is manufactured with HDI, and the cost will be lower than the traditional complex lamination process.
2. Increase line density: interconnection of traditional circuit boards and parts
3. Conducive to the use of advanced construction technology
4. Has better electrical performance and signal accuracy
5. Better reliability
6. Can improve thermal properties
7. Can improve radio frequency interference/electromagnetic wave interference/electrostatic discharge (RFI/EMI/ESD)
8. Increase design efficiency

 

HDI is the abbreviation of High Density Interconnector, which is a (technology) for the production of printed circuit boards. HDI is a compact product designed for small volume users.

 

 

PCB CAPABILITIES

 
FACTORY CAPABILITIES
No.Items20192020
1HDI CapabilitiesHDI ELIC (4+2+4)HDI ELIC(5+2+5)
2Max layer count32L36L
3Board ThicknessCore thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mmCore thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mm
4Min.Hole SizeLaser 0.075mmLaser 0.05mm
Mechnical 0.15mmMechnical 0.15mm
5Min Line Width/Space0.035mm/0.035mm0.030mm/0.030mm
6Copper Thickness1/3oz-4oz1/3oz-6oz
7Size Max Panel size700x610mm700x610mm
8Registration Accuracy+/-0.05mm+/-0.05mm
9Routing Accuracy+/-0.075mm+/-0.05mm
10Min.BGA PAD0.15mm0.125mm
11Max Aspect Ratio10:110:1
12Bow and Twist0.50%0.50%
13Impedance Control Tolerance+/-8%+/-5%
14Daily Output3,000m2 (Max capacity of equipment)4,000m2 (Max capacity of equipment)
15Surface FinishingENEPING /ENIG /HASL /FINGER GOLD/IMMERSION TIN/SELECTIVE THICK GOLD
16Raw MaterialFR-4/Normal Tg/High Tg/Low Dk/HF FR4/PTEE/PI
 

The types of HDI PCB


1.through vias from surface to surface,
2.with buried vias and through vias,
3.two or more HDI layer with through vias,
4.passive substrate with no electrical connection,
5.coreless construction using layer pairs
6.alternate constructions of coreless constructions using layer pairs.

 

HDI (High Density Interconnection) circuit boards usually include laser blind vias and mechanical blind vias; general through buried vias, blind vias, stacked vias, staggered vias, cross blind buried, through vias, blind via filling plating, fine line small gaps, The technology of realizing the conduction between the inner and outer layers by processes such as micro-holes in the disk, usually the diameter of the blind buried is not more than 6 mils.

 

 

 

Work flow for HDI

 

Board Cut - Inner Wet film -DES - AOI - Brown Oxido - Outer Layer Press - Out Layer Lamination - X-RAY & Rounting - Copper reduce & brown oxide - Laser Drilling - Drilling - Desmear PTH - Panel plating - Outer Layer dry film - Etching - AOI- Impedance Testing - S/M Pluged hole - Solder Mask - Component Mark - Impedance testing - Immersion Gold -V-cut - Routing - Electrical Test - FQC - FQA -Package -Shipment

 

 

Similar products

 

 

HDI PCB Board Application Field 

 

Our PCB are widely used in mobile phones, digital (camera) cameras, notebook computers, automotive electronics and other digital products, communication equipment, industrial control, consumer electronics, medical equipment, aerospace, light-emitting diode lighting, automotive electronics etc.

 

 

Workshop

 

 

 

Common packaging

 

1.PCB: Vacuum packaging with carton box
2.PCBA: ESD packaging with carton box

 

 

 

Our advantage

 

1.Service value

Independent quotation system to quickly serve the market

2.PCB manufacturing

High-tech PCB and PCB assembly production line

3.Material purchasing

A team of experienced electronic component procurement engineers

4.SMT post soldering

Dust-free workshop, high-end SMT patch processing

 

 

 

 

Company information

 

We have profuse experience in manufacturing PCB,owned experienced technical R & D technology team, young and professional sales and customer service team, experienced and professional procurement team and assembly testing team, which make sure the products quality of the pass rate, on-time delivery rate of customer orders.

 

Our services include: circuit board design and layout, 2-46 layers PCB manufacturing, professional FPC production, electronic components purchasing, SMT professional processing, Soldering and Assembly, especially sample and small bulk orders. we have the advantages of a quick quote, fast production, fast delivery.

Product Tags: fr-4 hdi pcb   6 layer hdi pcb   communications high density pcb  
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