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High Tg FR-4 HASL ENIG OEM HF 6 Layer HDI PCB Board

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Beijing Haina Lean Technology Co., Ltd

City: beijing

Province/State:beijing

Country/Region:china

Tel:86--13722988404

Contact Person:
Miss.Marina View Contact Details

High Tg FR-4 HASL ENIG OEM HF 6 Layer HDI PCB Board

Brand Name	HNL-PCBA
Model Number	PCB Assembly 012
Certification	ISO9001,IS16949, ISO14001,ROHS , UL, IPC-A , UL, QC080000
Place of Origin	CHINA
Minimum Order Quantity	1 PC
Price	Negotiable
Payment Terms	T/T, Western Union, L/C, MoneyGram
Supply Ability	10,000,000 Point /Day
Delivery Time	1-7days
Packaging Details	ESD packaging with carton box
Product name	HDI PCB Board
Material	FR4, HASL LEAD FREE
Copper thickness	0.3OZ up to 6OZ
Min. line spacing	0.030mm,0.05mm ETC.
Min. hole size	0.05mm, 0.1mm, 0.25mm, 0.1mm/4mil; custom
Service	One-stop Service,PCB&PCBA,ODM and OEM
Usage	OEM Electronics,Circuit Board Assembly
Board thickness	0.3mm up to 3.5mm; custom
Pcb test	Flying probe and AOI (Default)/Fixture Test,100% Testing
Solder mask color	Green,Blue,White and Red,White Black Yellow Green Red

Detailed Product Description

High Tg FR-4 HASL ENIG OEM Multilayer HF 6Layer HDI PCB Board

HDI PCB Board Introduction

HDI PCB is a special type of PCB, and it has the capability of high-density interconnections. In other words, it has more wires or conduction lines per unit area, utilizing the most of the space & offering a compact PCB. But the board functionally isn’t affected.

HDI Board contains blind and buried vias and often contain microvias of 0.006 or less in diameter.

HDI board has higher circuitry density than traditional circuit boards.

All of the other electronic components are mounted on the printed circuit boards(PCBs),which are the foundation.

PCBs have mechanical and electrical attributes,making them for ideal applications. Most PCB’s fabricated are rigid, roughly 90% of the PCB’s manufactured today are rigid boards.

PCB CAPABILITIES

FACTORY CAPABILITIES
No.	Items	2019	2020
1	HDI Capabilities	HDI ELIC (4+2+4)	HDI ELIC(5+2+5)
2	Max layer count	32L	36L
3	Board Thickness	Core thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mm	Core thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mm
4	Min.Hole Size	Laser 0.075mm	Laser 0.05mm
4	Min.Hole Size	Mechnical 0.15mm	Mechnical 0.15mm
5	Min Line Width/Space	0.035mm/0.035mm	0.030mm/0.030mm
6	Copper Thickness	1/3oz-4oz	1/3oz-6oz
7	Size Max Panel size	700x610mm	700x610mm
8	Registration Accuracy	+/-0.05mm	+/-0.05mm
9	Routing Accuracy	+/-0.075mm	+/-0.05mm
10	Min.BGA PAD	0.15mm	0.125mm
11	Max Aspect Ratio	10:1	10:1
12	Bow and Twist	0.50%	0.50%
13	Impedance Control Tolerance	+/-8%	+/-5%
14	Daily Output	3,000m2 (Max capacity of equipment)	4,000m2 (Max capacity of equipment)
15	Surface Finishing	ENEPING /ENIG /HASL /FINGER GOLD/IMMERSION TIN/SELECTIVE THICK GOLD
16	Raw Material	FR-4/Normal Tg/High Tg/Low Dk/HF FR4/PTEE/PI

The types of HDI PCB

1.through vias from surface to surface,
2.with buried vias and through vias,
3.two or more HDI layer with through vias,
4.passive substrate with no electrical connection,
5.coreless construction using layer pairs
6.alternate constructions of coreless constructions using layer pairs.

Work flow for HDI

Board Cut - Inner Wet film -DES - AOI - Brown Oxido - Outer Layer Press - Out Layer Lamination - X-RAY & Rounting - Copper reduce & brown oxide - Laser Drilling - Drilling - Desmear PTH - Panel plating - Outer Layer dry film - Etching - AOI- Impedance Testing - S/M Pluged hole - Solder Mask - Component Mark - Impedance testing - Immersion Gold -V-cut - Routing - Electrical Test - FQC - FQA -Package -Shipment

PCB Assembly Process

Delivery Time

Product Type	Qty	Normal lead time	Quick-turn lead time
SMT+DIP	1-50	1WD-2WD	8H
SMT+DIP	51-200	2WD-3WD	1.5WD
SMT+DIP	201-2000	3WD-4WD	2WD
SMT+DIP	≥2001	4WD-5WD	3WD
PCBA(2-4Layer)	1-50	2.5WD-3.5WD	1WD
PCBA(2-4Layer)	51-2000	5WD-6WD	2.5WD
PCBA(2-4Layer)	≥2001	≥7WD	5WD
PCBA(6-10Layer)	1-50	3WD-4WD	2.5WD
PCBA(6-10Layer)	51-2000	7WD-8WD	6WD
PCBA(10-HDILayer)	1-50	7WD-9WD	5WD
PCBA(10-HDILayer)	51-2000	9WD-11WD	7WD

HDI PCB Board Application Field

Our products are widely used in communication equipment, industrial control, consumer electronics, medical equipment, aerospace, light-emitting diode lighting, automotive electronics etc.

Workshop

Common packaging

1.PCB: Vacuum packaging with carton box
2.PCBA: ESD packaging with carton box

Our advantage

1.Service value

Independent quotation system to quickly serve the market

2.PCB manufacturing

High-tech PCB and PCB assembly production line

3.Material purchasing

A team of experienced electronic component procurement engineers

4.SMT post soldering

Dust-free workshop, high-end SMT patch processing

Product Tags: OEM HDI PCB Board High Tg HDI PCB Board 6 Layer high density

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High Tg FR-4 HASL ENIG OEM HF 6 Layer HDI PCB Board

High Tg FR-4 HASL ENIG OEM HF 6 Layer HDI PCB Board

High Tg FR-4 HASL ENIG OEM Multilayer HF 6Layer HDI PCB Board

HDI PCB Board Introduction

PCB CAPABILITIES

The types of HDI PCB

Work flow for HDI

Similar products

Delivery Time

HDI PCB Board Application Field

Common packaging

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