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F4BME265 Substrate High Frequency Laminates Copper Clad Sheet

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F4BME265 Substrate High Frequency Laminates Copper Clad Sheet

Brand Name Bicheng
Model Number BIC-332.V1.0
Certification UL, ISO9001, IATF16949
Place of Origin CHINA
Minimum Order Quantity 1PCS
Price USD9.99-99.99
Payment Terms T/T
Supply Ability 5000PCS per month
Delivery Time 8-9 working days
Packaging Details Vacuum bags+Cartons
Part number F4BME265
Laminate thickness 0.1 - 12mm
Laminate size 460X610mm, 500X600mm, 850X1200mm, 914X1220mm, 1000X1200mm, 300X250mm, 350X380mm, 500X500mm, 840X840mm, 1000X1500mm
Copper weight 0.5OZ(0.018mm); 1OZ(0.035mm);
Detailed Product Description

The F4BME265 is a high-frequency laminate manufactured through a precisely controlled process using woven glass fabric, PTFE (polytetrafluoroethylene) resin, and PTFE film. Offering enhanced electrical performance compared to standard F4B materials, it features a wider dielectric constant range, lower dissipation factor, higher insulation resistance, and superior stability, making it a reliable alternative to equivalent foreign products.

 

The F4BM and F4BME series share an identical dielectric core but are differentiated by their copper foil type:

 

F4BM is paired with ED (electrodeposited) copper foil, designed for applications where Passive Intermodulation (PIM) is not a critical factor.

 

F4BME utilizes reverse-treated RTF (reverse treated foil) copper foil, delivering excellent PIM performance, enabling finer circuit resolution, and achieving lower conductor loss.

 

By precisely adjusting the ratio of PTFE resin to glass fabric, the F4BM and F4BME series achieve targeted dielectric constants while maintaining low loss and enhanced dimensional stability. Higher dielectric constant grades contain a higher proportion of glass, resulting in improved dimensional stability, a lower coefficient of thermal expansion (CTE), and better temperature drift characteristics, though with a marginal increase in dielectric loss.

 

 

Product Features
◈DK2.17~3 is optional, and DK can be customized

◈ Low loss
◈ F4BME paired with RTF copper foil provides excellent PIM performance
◈ Diverse size options for cost savings
◈ Radiation resistant, low outgassing
◈ Commercial availability, mass production capability, high cost-performance ratio

 

Typical Applications
◈ Microwave, Radio Frequency, Radar
◈ Phase shifters, passive components
◈ Power dividers, couplers, combiners
◈ Feed networks, phased array antennas
◈ Satellite communications, base station antennas

 

Product Technical ParametersProduct Model & Data Sheet
Product FeaturesTest ConditionsUnitF4BME265
Dielectric Constant (Typical)10GHz/2.65
Dielectric Constant Tolerance//±0.05
Loss Tangent (Typical)10GHz/0.0013
20GHz/0.0019
Dielectric Constant Temperature Coefficient-55ºC~150ºCPPM/℃-100
Peel Strength1 OZ F4BMN/mm>1.8
1 OZ F4BMEN/mm>1.6
Volume ResistivityStandard ConditionMΩ.cm≥6×10^6
Surface ResistivityStandard Condition≥1×10^6
Electrical Strength (Z direction)

5KW,500V/s

 

KV/mm>25
Breakdown Voltage (XY direction)5KW,500V/sKV>34
Coefficientof Thermal ExpansionXY direction-55 º~288ºCppm/ºC14, 17
Z direction-55 º~288ºCppm/ºC142
Thermal Stress260℃, 10s,3 timesNo delamination
Water Absorption20±2℃, 24 hours%≤0.08
DensityRoom Temperatureg/cm32.25
Long-Term Operating TemperatureHigh-Low Temperature Chamber-55~+260
Thermal ConductivityZ directionW/(M.K)0.36
PIMOnly applicable to F4BMEdBc≤-159
Flammability/UL-94V-0
Material Composition//PTFE, Fiberglass Cloth
F4BM paired with ED copper foil, F4BME paired with reverse-treated (RTF) copper foil.

 

Product Tags: F4BME265 high frequency copper laminate   copper clad sheet substrate   high frequency laminates with warranty  
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