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RT duroid 6002 PCB 2-layer 0.8mm Thick with Immersion Silver

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Bicheng Electronics Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-755-27374847

Contact Person:
Ms.Ivy Deng
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RT duroid 6002 PCB 2-layer 0.8mm Thick with Immersion Silver

Brand Name Bicheng
Model Number BIC-332.V1.0
Certification UL, ISO9001, IATF16949
Place of Origin CHINA
Minimum Order Quantity 1PCS
Price USD9.99-99.99
Payment Terms T/T
Supply Ability 5000PCS per month
Delivery Time 8-9 working days
Packaging Details Vacuum bags+Cartons
PCB material RT/duroid 6002
Layer count 2-layer
PCB thickness 0.8mm
PCB size 156mm x 87.9mm (per piece)
Copper weight 1oz (1.4 mils) outer layers
Surface finish Immersion Silver
Detailed Product Description

This PCB is a two-layer rigid PCB fabricated using Rogers RT/duroid 6002, a ceramic-filled polytetrafluoroethylene (PTFE) microwave laminate distinguished by its low dielectric constant and minimal loss properties. It is engineered with a finished thickness of 0.8 mm, 1 oz (1.4 mils) copper cladding on the outer layers, and an Immersion Silver surface finish, which collectively ensure consistent and reliable performance for sophisticated microwave and high-frequency electronic systems.

 

PCB Details

ItemSpecification
Base materialRT/duroid 6002
Layer count2 layers
Board dimensions156mm x 87.9mm (per piece)
Minimum Trace/Space6/7 mils
Minimum Hole Size0.3mm
Blind viasNone
Finished board thickness0.8mm
Finished Cu weight (outer layers)1 oz (1.4 mils)
Via plating thickness20 μm
Surface finishImmersion Silver
Top SilkscreenNo
Bottom SilkscreenNo
Top Solder MaskNo
Bottom Solder MaskNo
Electrical test100% electrical test conducted prior to shipment

 

PCB Stack-up

This is a 2-layer rigid PCB with the following stack-up structure (from top to bottom):

Layer TypeSpecification
Copper_layer_135 μm
Rogers RT/duroid 6002 Substrate30mil (0.762mm)
Copper_layer_235 μm

 

 

Artwork and Quality Standard

The artwork format provided for this PCB is Gerber RS-274-X, a globally accepted industry standard for PCB manufacturing. In addition, the PCB complies with the IPC-Class-2 standard, which sets strict guidelines for performance and reliability, ensuring the product meets the operational requirements of commercial and industrial applications.

 

Availability

This high-performance PCB can be shipped to any country around the world. It caters to both prototyping requirements and large-volume production orders, ensuring global accessibility for all customers.

 

Introduction of RT/duroid 6002

Rogers RT/duroid 6002 laminates are ceramic-filled PTFE microwave materials with low dielectric constant for use in complex microwave structures. They are also low loss materials that provide excellent high frequency performance. Offering excellent mechanical and electrical properties, these materials are reliable for use in multi-layer board constructions.

 

Benefits of RT/duroid 6002

  • Low loss for excellent high frequency performance
  • Tight thickness control
  • In-plane expansion coefficient matched to copper; Ideal for applications sensitive to temperature change
  • Low out-gassing; Ideal for space applications
  • Excellent dimensional stability
  • Excellent mechanical and electrical properties; Reliable multi-layer board constructions

 

Typical Applications

  • Phased Array Antennas
  • Ground Based and Airborne Radar Systems
  • Global Positioning System Antennas
  • Power Backplanes
  • Commercial Airline Collision Avoidance
  • Beam Forming Networks

 

RT/duroid 6002 – High Frequency Laminates

RT/duroid 6002 microwave material was the first low-loss, low-dielectric-constant laminate to offer the superior electrical and mechanical properties essential for designing complex microwave structures that are both mechanically reliable and electrically stable.

 

The material features an extremely low thermal coefficient of dielectric constant from -55°C to +150°C (-67°F to 302°F), providing designers of filters, oscillators, and delay lines with the electrical stability required in today's demanding applications.

 

A low Z-axis coefficient of thermal expansion (CTE) ensures excellent plated through-hole reliability. RT/duroid 6002 materials have been successfully temperature cycled from -55°C to 125°C (-67°F to 257°F) for over 5,000 cycles without a single via failure.

 

Excellent dimensional stability (0.2 to 0.5 mils/inch) is achieved by matching the X and Y axis coefficients of expansion to that of copper. This often eliminates the need for double etching to achieve tight positional tolerances.

 

The low tensile modulus in the X and Y axes greatly reduces stress applied to solder joints and allows the laminate's expansion to be constrained by a minimal amount of low-CTE metal (6 ppm/°C), further enhancing surface mount reliability.

 

Dielectric thicknesses from 0.005 inches to 0.125 inches (0.13 to 3.18 mm) are available, with cladding options including 0.5 oz/ft² to 2 oz/ft² electrodeposited copper, 0.5 oz/ft² to 1 oz/ft² reverse-treated electrodeposited copper, or 0.5 oz/ft² to 2 oz/ft² rolled copper. RT/duroid 6002 laminate is also available clad with aluminum, brass, or copper plates, as well as resistive foils.

 

Applications particularly well-suited to the unique properties of RT/duroid 6002 include flat and non-planar structures such as antennas, complex multilayer circuits with interlayer connections, and microwave circuits for aerospace designs operating in harsh environments. RT/duroid 6002 laminates are UL recognized under classification 94V-0 (Vertical Flammability Test).

 

Dielectric Constant, εr

Process

2.94 ± 0.04Z-10GHz/23°CIPC-TM-650, 2.5.5.5
[2]Dielectric Constant, εr Design2.94  8GHz-40GHz

Differential Phase Length

Method

Dissipation Factor, TAN δ0.0012Z-10 GHz/23°CIPC-TM-650, 2.5.5.5
Thermal Coefficient of εr+12Zppm/°C

10 GHz

0-100°C

IPC-TM-650, 2.5.5.5
Volume Resistivity106ZMohm cmAASTM D257
Surface Resistivity107ZMohmAASTM D257
Tensile Modulus828 (120)X,YMPa (kpsi)

 

23°C

 

ASTM D638

Ultimate Stress6.9 (1.0)X,YMPa (kpsi)
Ultimate Strain7.3X,Y%
Compressive Modulus2482 (360)ZMPa (kpsi) ASTM D638
Moisture Absorption0.02-%D48/50

IPC-TM-650, 2.6.2.1

ASTM D570

Thermal Conductivity0.60-W/m/K80°CASTM C518

Coefficient of

Thermal Expansion (-55 to 288 °C)

16

16

24

X

Y

Z

 

ppm/°C

 

23°C/50% RH

IPC-TM-650 2.4.41
Td500 °CTGA ASTM D3850
Density2.1 gm/cm3 ASTM D792
Specific Heat0.93 (0.22)-J/g/K (BTU/lb/°F)-Calculated
Copper Peel8.9 (1.6) lbs/in (N/mm) IPC-TM-650 2.4.8
FlammabilityV-O   UL94
Lead-Free Process CompatibleYES    
 
Standard Thicknesses Standard Panel Sizes Standard Claddings

0.010” (0.252mm) +/- 0.0007”

0.020” (0.508mm) +/- 0.0010”

0.030” (0.762mm) +/- 0.0010”

0.060” (1.524mm) +/- 0.0020”

 

 

 

18”X 12”(457mm X 305mm)

18”X 24”(457mm X 610mm)

 

 

 

 

Electrodeposited Copper Foil ½ oz. (18µm) HH/HH

1 oz. (35µm) H1/H1

Rolled Copper Foil

½ oz. (18µm) AH/AH

1 oz. (35µm) A1/A1

 

 

 

Product Tags: F4BM255 high frequency PCB laminate   copper clad sheet for PCBs   high frequency copper clad laminate  
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