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Rogers RO4725JXR Substrate High Frequency Laminates Copper Clad Sheet

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Province/State:guangdong

Country/Region:china

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Rogers RO4725JXR Substrate High Frequency Laminates Copper Clad Sheet

Brand Name Bicheng
Model Number BIC-332.V1.0
Certification UL, ISO9001, IATF16949
Place of Origin CHINA
Minimum Order Quantity 1PCS
Price USD9.99-99.99
Payment Terms T/T
Supply Ability 5000PCS per month
Delivery Time 8-9 working days
Packaging Details Vacuum bags+Cartons
Part number RO4725JXR
Laminate thickness 0.78mm; 1.542mm
Laminate size 24”X 18”(610 X 457 mm);24”X 21”(610 X 533 mm);24”X 36”(610 X 915 mm);48”X 36”(1219 X 915 mm)
Copper weight Electrodeposited Copper Foil½ oz (18μm) HH/HH; 1 oz (35μm) H1/H1; LoPro Reverse Treated Electrodeposited Copper Foil ½ oz (18μm) TH/TH 1 oz (35μm) T1/T1
Detailed Product Description

RO4725JXR antenna-grade laminates offer a reliable, high-performance alternative to conventional PTFE-based materials, combining excellent electrical characteristics with enhanced processability.

 

Engineered specifically for antenna applications, RO4725JXR laminates deliver the precise electrical and mechanical properties designers require. With a dielectric constant (Dk) of 2.55 and a low loss tangent (Df) of just 0.0022 at 2.5 GHz (using LoPro® reverse-treated ED copper foil), these materials enable substantial antenna gain while minimizing signal loss. Additionally, they demonstrate exceptional low PIM performance, consistently achieving values below -160 dBc (tested with a 43dBm, 1900 MHz signal).

 

Unlike traditional PTFE-based laminates, RO4725JXR requires no special plated through-hole preparation and is fully compatible with conventional epoxy processing and high-temperature lead-free soldering. Lamination is readily achieved using RO4400™ bondply series at 175°C. The specially formulated thermoset resin system in RO4700JXR materials is designed to meet the demanding needs of modern antenna designs, featuring a glass transition temperature exceeding 280°C (536°F). This high Tg ensures low Z-axis CTE, excellent plated through-hole reliability, and seamless lead-free solder processability.

 

 

Features and Benefits

RO4700 Series Laminates – Low Loss Dielectric with Low Profile Foil
- Reduced PIM for superior signal integrity
- Low insertion loss for enhanced efficiency
- RO4725JXR: Stable Dk of 2.55

 

Unique Filler / Closed Microspheres
- Low density for reduced weight
- 30% lighter than PTFE/glass materials

 

Low Z-axis CTE (<30 ppm/°C) & High Tg (>280°C)
- Design flexibility for complex architectures
- Compatible with automated assembly processes

 

Low TCDk (<40 ppm/°C)
- Consistent circuit performance across temperature variations

 

Specially Formulated Thermoset Resin System
- Low TCDk for stable electrical performance
- Precise 2.55 Dk control
- Ease of fabrication with standard processes
- Robust PTH process capability

 

Environmentally Friendly
- Lead-free process compatible
- RoHS compliant

 

Typical Applications
- Cellular base station antennas

 

PropertyRO4725JXRDirectionUnitsConditionTest Method
Dielectric Constant, εr Process2.55 ± 0.05Z 10 GHz/23°CIPC-TM-650, 2.5.5.5
Dielectric Constant, εr Design2.64Z 1.7 GHz - 5
GHz
Differential Phase Length Method
Dissipation Factor0.0026Z 10 GHz/23°CIPC-TM-650, 2.5.5.5
0.0022 2.5GHz
Thermal Coefficient of εr+34Zppm/°C-50°C to 150°CIPC-TM-650, 2.5.5.5
Volume Resistivity (0.030")2.16 X 10^8 MΩ•cmCOND AIPC-TM-650, 2.5.17.1
Surface Resistivity (0.030")4.8 X 10^7 MΩCOND AIPC-TM-650, 2.5.17.1
PIM-166 dBc50 ohm
0.060”
43dBm
1900MHz
Electrical Strength (0.030”)630ZV/mil IPC-TM-650, 2.5.6.2
Flexural Strength MD121 (17.5) MPa
(kpsi)
RTASTM D790
CMD92 (13.3) 
Dimensional Stability<0.4X,Ymm/mafter etch
+E2/150°C
IPC-TM-650, 2.4.39A
Coefficient of Thermal
Expansion
13.9Xppm/°C-55 TO 288°CIPC-TM-650, 2.1.24
19.0Y
25.6Z
Thermal Conductivity0.38ZW/mK°50°CASTM D5470
Moisture Absorption0.24% %48/50IPC-TM-650 2.6.2.1 ASTM D570
Tg>280 °C IPC-TM-650 2.4.24
Td439 °C ASTM D3850
Density1.27 gm/cm3 ASTM D792
Copper Peel Strength8.5 pli1 oz LoPro EDCIPC-TM-650 2.4.8
FlammabilityN/A   UL94
Lead-Free Process CompatibleYES    
Product Tags: Rogers RO4725JXR high frequency laminate   copper clad laminate substrate   high frequency copper clad sheet  
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