F4BM255 PCB Material High Frequency Laminates Copper Clad Sheet

F4BM255 is manufactured using fiberglass cloth, polytetrafluoroethylene (PTFE) resin, and PTFE film through a scientifically formulated process and strict pressing techniques. Its electrical performance is enhanced compared to F4B, primarily reflected in a wider dielectric constant range, lower dielectric loss, increased insulation resistance, and improved stability, making it a viable alternative to similar international products.

F4BM and F4BME share the same dielectric layer but differ in the copper foil used: F4BM is paired with ED copper foil, suitable for applications without PIM requirements.

F4BM and F4BME achieve precise dielectric constant control by adjusting the ratio between PTFE and fiberglass cloth, ensuring low loss while enhancing material dimensional stability. A higher dielectric constant corresponds to a higher fiberglass ratio, resulting in better dimensional stability, lower coefficient of thermal expansion (CTE), improved thermal drift performance, and relatively increased dielectric loss.

Product Features

• DK selectable from 2.17 to 3.0, with customizable DK options available
• Low loss
• F4BME paired with RTF copper foil for excellent PIM performance
• Diverse size options for cost efficiency
• Radiation resistance, low outgassing
• Commercial availability, high-volume production, cost-effective

Typical Applications

• Microwave, RF, radar systems
• Phase shifters, passive components
• Power dividers, couplers, combiners
• Feed networks, phased array antennas
• Satellite communications, base station antennas