AD250C PCB Material High Frequency Laminates Copper Clad Sheet
|
|
AD250C is a glass-reinforced, PTFE-based composite engineered to deliver a stable dielectric constant, low signal loss, and excellent passive intermodulation (PIM) performance. The woven glass construction enhances circuit processability and supports high-yield PCB fabrication.
AD250C meets the diverse requirements of modern antenna designs. This versatility, combined with precise dielectric control, ensures consistent impedance performance across production runs.
The material is offered with standard electrodeposited (ED) copper or reverse-treated ED copper foil, allowing designers to optimize for reduced circuit loss and improved PIM performance.
As a PTFE-based composite, AD250C exhibits exceptionally low loss—typically below 0.002 at 10 GHz—along with minimal moisture absorption (<0.1%) and high copper peel strength (>10 pli). These characteristics make AD250C laminates a reliable, high-performance solution for antenna applications.
Features and Benefits
Typical Applications
|
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Product Tags: AD250C PCB high frequency laminates copper clad sheet PCB material high frequency copper clad laminates |
|
TLX-8 PCB Material High Frequency Laminates Copper Clad Sheet |
|
AD255C PCB Material High Frequency Laminates Copper Clad Sheet |
|
F4BM255 PCB Material High Frequency Laminates Copper Clad Sheet |
|
F4BME255 Substrate High Frequency Laminates Copper Clad Sheet |
|
Rogers RO4725JXR Substrate High Frequency Laminates Copper Clad Sheet |
|
TLX-7 Substrate High Frequency Laminates Copper Clad Sheet |
