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AD250C PCB Material High Frequency Laminates Copper Clad Sheet

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Bicheng Electronics Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-755-27374847

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AD250C PCB Material High Frequency Laminates Copper Clad Sheet

Brand Name Bicheng
Model Number BIC-332.V1.0
Certification UL, ISO9001, IATF16949
Place of Origin CHINA
Minimum Order Quantity 1PCS
Price USD9.99-99.99
Payment Terms T/T
Supply Ability 5000PCS per month
Delivery Time 8-9 working days
Packaging Details Vacuum bags+Cartons
Part number AD250C
Laminate thickness 0.020” (0.508 mm) +/- 0.002” 0.030” (0.762 mm) +/- 0.002” 0.060” (1.524 mm) +/- 0.003”
Laminate size 18”x 12”(457mm x 305mm) 18”x 24”(457mm x 610mm)
Copper weight Electrodeposited Copper Foil ½ oz. (18µm) 1oz. (35µm) Reverse Treated Electrodeposited Copper Foil ½ oz. (18µm) 1oz. (35µm)
Detailed Product Description

AD250C is a glass-reinforced, PTFE-based composite engineered to deliver a stable dielectric constant, low signal loss, and excellent passive intermodulation (PIM) performance. The woven glass construction enhances circuit processability and supports high-yield PCB fabrication.

 

AD250C meets the diverse requirements of modern antenna designs. This versatility, combined with precise dielectric control, ensures consistent impedance performance across production runs.

 

The material is offered with standard electrodeposited (ED) copper or reverse-treated ED copper foil, allowing designers to optimize for reduced circuit loss and improved PIM performance.

 

As a PTFE-based composite, AD250C exhibits exceptionally low loss—typically below 0.002 at 10 GHz—along with minimal moisture absorption (<0.1%) and high copper peel strength (>10 pli). These characteristics make AD250C laminates a reliable, high-performance solution for antenna applications.

 

 

Features and Benefits

  • Low loss tangent (<0.002 at 10 GHz) – Delivers excellent circuit performance across all common wireless frequency bands
  • Controlled dielectric constant (±0.05) – Ensures repeatable and reliable circuit performance
  • Very low PIM (-159 dBc at 30 mil, 1900 MHz) – Enhances antenna performance and minimizes yield loss due to PIM issues
  • Excellent dimensional stability – Supports consistent circuit performance and improved manufacturing yields

 

Typical Applications

  • Cellular infrastructure base station antennas
  • Automotive telematics antenna systems
  • Commercial satellite radio antennas

 

PropertiesAD250CUnitsTest ConditionsTest Frequency / DetailsTest Method
Electrical Properties     
Dielectric Constant (process)2.52-23°C @ 50% RH10 GHzIPC TM-650 2.5.5.5
Dielectric Constant (design)2.50-C-24/23/5010 GHz, Microstrip Differential Phase Length-
Dissipation Factor0.0013-23°C @ 50% RH10 GHzIPC TM-650 2.5.5.5
Thermal Coefficient of Dielectric Constant-117ppm/°C0 to 100°C10 GHzIPC TM-650 2.5.5.5
Volume Resistivity4.8 × 10⁸MΩ·cmC96/35/90-IPC TM-650 2.5.17.1
Surface Resistivity4.1 × 10⁷C96/35/90-IPC TM-650 2.5.17.1
Electrical Strength (dielectric strength)979V/mil--IPC TM-650 2.5.6.2
Dielectric Breakdown>40kVD-48/50X/Y directionIPC TM-650 2.5.6
PIM-159/-163dBcReflected 43 dBm swept tones at 1900 MHz S1/S150 ohmRogers Internal
Thermal Properties     
Decomposition Temperature (Td)>500°C2 hrs @ 105°C5% Weight LossIPC TM-650 2.3.40
CTE x47ppm/°C-55°C to 288°C-IPC TM-650 2.4.41
CTE y29ppm/°C-55°C to 288°C-IPC TM-650 2.4.41
CTE z196ppm/°C-55°C to 288°C-IPC TM-650 2.4.41
Thermal Conductivity0.33W/(m·K)-z directionASTM D5470
Time to Delamination>60minutesas-received288°CIPC TM-650 2.4.24.1
Mechanical Properties     
Copper Peel Strength2.6 (14.8)N/mm (lbs/in)10 s @288°C35 μm foilIPC TM-650 2.4.8
Flexural Strength (MD/CMD)60.7/44.1 (8.8/6.4)MPa (ksi)25°C ± 3°C-ASTM D790
Tensile Strength (MD, CMD)41.4/38.6 (6.0/5.6)MPa (ksi)23°C @ 50% RH-ASTM D3039/D3039-14
Flex Modulus6102/5364 (885/778)MPa (ksi)25°C ± 3°C-IPC-TM-650 2.4.4
Dimensional Stability (MD, CMD)0.02/0.06mils/inchafter etch + bake-IPC-TM-650 2.4.39a
Physical Properties     
FlammabilityV-0---UL 94
Moisture Absorption0.04%E1/105 + D48/50-IPC TM-650 2.6.2.1
Density2.28g/cm³C24/23/50-ASTM D792
Specific Heat Capacity0.813J/g·K2 hours at 105°C-ASTM E2716
Product Tags: AD250C PCB high frequency laminates   copper clad sheet PCB material   high frequency copper clad laminates  
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