TLY-5 laminates are fabricated using ultra-lightweight woven
fiberglass substrates, delivering superior dimensional stability
compared to chopped fiber-reinforced PTFE composites. The woven
fiber matrix inherent to TLY-5 imparts enhanced mechanical
robustness to the laminate, rendering it well-suited for
high-volume production environments. Boasting a low dissipation
factor, this material is ideally engineered for 77 GHz automotive
radar systems and a broad spectrum of other millimeter-wave antenna
applications.
Comparative OEM validation testing conducted at 77 GHz—pitting
lightly reinforced TLY-5 against its closest chopped
fiber-reinforced counterpart—has verified drop-in compatibility,
with equivalent insertion loss and dielectric performance metrics.
The key competitive advantage lies in TLY-5’s substantially higher
manufacturing yields.
TLY-5 features a dielectric constant (Dk) range of 2.17–2.40. For
the majority of available thicknesses, the Dk value can be
customized to any point within this interval, with a tight
tolerance of ±0.02. At 10 GHz, the material exhibits a dissipation
factor (Df) of approximately 0.0009, a standout performance within
the low-Dk material category.
Key Benefits
- Exceptional dimensional stability
- Industry-leading low dissipation factor
- High peel strength
- Minimal moisture absorption
- Uniform, consistent dielectric constant
- Laser ablatable
Typical Applications
- Automotive radar systems
- Satellite and cellular communications infrastructure
- Power amplifiers
- Low-noise blocks (LNBs), low-noise amplifiers (LNAs), low-noise
converters (LNCs)
- Aerospace and avionics
- Ka-band, E-band, and W-band systems
- Phased array antennas and RF filters/couplers
| TLY TYPICAL VALUES |
| Property | Test Method | Unit | Value | Unit | Value |
| DK at 10 GHz | IPC-650 2.5.5.5 | | 2.2 | | 2.2 |
| Df at 10 GHz | IPC-650 2.5.5.5 | | 0.0009 | | 0.0009 |
| Moisture Absorption | IPC-650 2.6.2.1 | % | 0.02 | % | 0.02 |
| Dielectric Breakdown | IPC-650 2.5.6 | kV | >45 | kV | >45 |
| Dielectric Strength | ASTM D 149 | V/mil | 2,693 | V/mil | 106,023 |
| Volume Resistivity | IPC-650 2.5.17.1(after elevated temp.) | Mohms/cm | 1010 | Mohms/cm | 1010 |
| Volume Resistivity | IPC-650 2.5.17.1(after humidity) | Mohms/cm | 1010 | Mohms/cm | 109 |
| Surface Resistivity | IPC-650 2.5.17.1(after elevated temp.) | Mohms | 108 | Mohms | 108 |
| Surface Resistivity | IPC-650 2.5.17.1(after humidity) | Mohms | 108 | Mohms | 108 |
| Flex Strength(MD) | IPC-650 2.4.4 | psi | 14,057 | N/mm2 | 96.91 |
| Flex Strength(CD) | IPC-650 2.4.4 | psi | 12,955 | N/mm2 | 89.32 |
| Peel Stength(½ oz.ed copper) | IPC-650 2.4.8 | Ibs./inch | 11 | N/mm | 1.96 |
| Peel Stength(1 oz.CL1 copper) | IPC-650 2.4.8 | Ibs./inch | 16 | N/mm | 2.86 |
| Peel Stength(1 oz..CV1 copper) | IPC-650 2.4.8 | Ibs./inch | 17 | N/mm | 3.04 |
| Peel Stength | IPC-650 2.4.8(after elevated temp.) | Ibs./inch | 13 | N/mm | 2.32 |
| Young's Modulus(MD) | ASTM D 3039/IPC-650 2.4.19 | psi | 1.4 x 106 | N/mm2 | 9.65 x 103 |
| Poisson's Ratio(MD) | ASTM D 3039/IPC-650 2.4.19 | | 0.21 | | 0.21 |
| Thermal Conductivity | ASTM F 433 | W/M*K | 0.22 | W/M*K | 0.22 |
| Dimensional Stability(MD,10mil) | IPC-650 2.4.39(avg.after bake&thermal stress) | mils/inch | -0.038 | | -0.038 |
| Dimensional Stability(CD,10mil) | IPC-650 2.4.39(avg.after bake&thermal stress) | mils/inch | -0.031 | | -0.031 |
| Density(Specific Gravity) | ASTM D 792 | g/cm3 | 2.19 | g/cm3 | 2.19 |
| CTE(X axis)(25-260℃) | ASTM D 3386(TMA) | ppm/℃ | 26 | ppm/℃ | 26 |
| CTE(Y axis)(25-260℃) | ASTM D 3386(TMA) | ppm/℃ | 15 | ppm/℃ | 15 |
| CTE(Z axis)(25-260℃) | ASTM D 3386(TMA) | ppm/℃ | 217 | ppm/℃ | 217 |
| NASA Outgassing(% TML) | | | 0.01 | | 0.01 |
| NASA Outgassing(% CVCM) | | | 0.01 | | 0.01 |
| NASA Outgassing(% WVR) | | | 0.00 | | 0.00 |
| UL-94 Flammability Rating | UL-94 | | V-0 | | V-0 |
