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F4BM220 PCB 2 Layer 1.575mm 1oz Copper ENIG Finished

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Bicheng Electronics Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-755-27374847

Contact Person:
Ms.Ivy Deng
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F4BM220 PCB 2 Layer 1.575mm 1oz Copper ENIG Finished

Brand Name Bicheng
Certification UL, ISO9001, IATF16949
Place of Origin CHINA
Minimum Order Quantity 1PCS
Price USD9.99-99.99/PCS
Payment Terms T/T
Supply Ability 5000PCS per month
Delivery Time 8-9 working days
Packaging Details Vacuum bags+Cartons
Material F4BM220 Core - 1.575 mm
Layer count 2-layer
PCB size 130.5mm x 103 mm=1PCS, +/- 0.15mm
PCB thickness 1.7 mm
Surface finish Electroless Nickle Immersion Gold (ENIG)
Solder Mask No
Detailed Product Description

In the demanding world of RF and microwave electronics, signal integrity and material stability are paramount. Our 2-layer rigid PCB, constructed with Wangling's advanced F4BM220 PTFE/fiberglass laminate, delivers exceptional high-frequency performance for critical communication and radar systems. With its ultra-low loss characteristics and precise dielectric properties, this PCB is engineered to meet the rigorous demands of modern RF applications.

 

Precision Construction & Key Specifications

Base Material: High-performance F4BM220 PTFE/fiberglass composite for superior RF characteristics

 

Layer Count: 2 layers with 4/6 mil trace/space capability

 

Board Dimensions: 130.5mm × 103mm (±0.15mm tolerance)

 

Minimum Hole Size: 0.3mm (mechanical drilling)

 

Finished Thickness: 1.7mm (1.575mm core with 35μm copper layers)

 

Surface Finish: ENIG (Electroless Nickel Immersion Gold) for reliable solderability

 

Via Plating Thickness: 20μm for durable interconnects

 

Electrical Testing: 100% tested prior to shipment

 

Optimized Stackup for RF Performance
The 2-layer stackup is carefully engineered for maximum signal integrity:

 

Top Layer: 35μm ED copper foil

Core: 1.575mm F4BM220 laminate (PTFE/fiberglass composite)

Bottom Layer: 35μm ED copper foil

 

Special Design Considerations:

No solder mask or silkscreen to minimize dielectric interference

All vias are through-hole (no blind/buried vias)

Clean surface finish for optimal RF performance

 

Why Choose F4BM220 Material?
Superior High-Frequency Characteristics

 

Dielectric Constant (Dk): 2.2±0.04 @ 10GHz - exceptional stability for precise impedance control

 

Ultra-Low Loss: Dissipation Factor (Df) of 0.001 at 10GHz for minimal signal degradation

 

Thermal Stability: CTE of 25ppm/°C (x-axis), 34ppm/°C (y-axis) for dimensional reliability

 

Moisture Resistance: Absorption ≤0.08% for consistent performance in varied environments

 

 

Enhanced Reliability Features
UL-94 V0 flammability rating for safety compliance

 

Excellent temperature resistance (-55°C to 288°C operating range)

 

Thermal coefficient of Dk: -142ppm/°C (-55°C to 150°C) for stable performance

 

Ideal Applications
This PCB is specifically designed for high-frequency applications including:

 

Microwave and RF communication systems

Phase shifters and power dividers

Satellite communication equipment

Base station antennas and feed networks

Radar systems and phased array antennas

Couplers and combiners

 

Quality Assurance & Global Availability
We maintain strict quality standards to ensure reliable performance:

 

Compliant with IPC-Class-2 standards

 

Accepts Gerber RS-274-X artwork files

 

Worldwide availability with reliable shipping options

 

Product Tags: 1.575mm PCB   ENIG Finished PCB   F4BM220 PCB  
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