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2-layer F4BTMS265 PCB 30mil High-Frequency Substrate

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Bicheng Electronics Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-755-27374847

Contact Person:
Ms.Ivy Deng
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2-layer F4BTMS265 PCB 30mil High-Frequency Substrate

Layer count 2 Layers
Base material F4BTMS265
Solder mask Black
Copper weight 1oz (1.4 mils) outer copper layer
Surface finish ENIG (Electroless Nickel Immersion Gold)
Brand Name Bicheng
Model Number BIC-268.V1.0
Certification UL, ISO9001, IATF16949
Place of Origin CHINA
Minimum Order Quantity 1PCS
Price USD9.99-99.99
Payment Terms T/T
Supply Ability 5000PCS per month
Delivery Time 8-9 working days
Packaging Details Vacuum bags+Cartons
Silkscreen White
PCB thickness 0.85mm
PCB size 97mm × 76mm (1 piece), dimensional tolerance: ±0.15mm
Detailed Product Description

This 2-layer rigid high-frequency PCB features aerospace-grade F4BTMS265 ceramic-filled dielectric substrate with low electromagnetic loss and minimal anisotropy. It adopts ENIG surface treatment, black top solder mask and white top silkscreen, with a fully mask-free and silkscreen-free bottom side. All units pass 100% electrical testing before delivery, ensuring stable dielectric performance, low signal attenuation and reliable structure for aerospace, military and RF/microwave applications.

 

PCB Specifications

Parameter ItemSpecification
Base MaterialF4BTMS265 upgraded ceramic-filled high-frequency substrate
Layer Configuration2-layer rigid PCB structure
Board Dimension97mm × 76mm (1 piece), dimensional tolerance: ±0.15mm
Minimum Trace / Space14 mils / 14 mils
Minimum Mechanical Hole Diameter0.25mm
Via TypePure through-hole vias, no blind vias
Finished Board Thickness0.85mm
Outer Copper Weight1oz (1.4 mils) outer copper layer
Via Plating Thickness20μm
Surface FinishingENIG (Electroless Nickel Immersion Gold)
Top SilkscreenWhite silkscreen
Bottom SilkscreenSilkscreen-free
Top Solder MaskBlack solder mask
Bottom Solder MaskSolder mask-free
Quality Inspection100% full electrical testing performed prior to delivery

 

PCB Layer Stack-up Structure

Layer DefinitionTechnical Specification
Top Copper Layer35μm finished copper thickness
Dielectric Core SubstrateF4BTMS265 core, 0.762mm (30mil) thickness
Bottom Copper Layer35μm finished copper thickness

 

 

Artwork & Quality Compliance

Production File Standard: Fabricated based on industry-standard Gerber RS-274-X files, supporting high-precision circuit patterning and full compatibility with mainstream industrial manufacturing processes.

 

Quality Standard: All fabrication and inspection procedures comply strictly with IPC-Class-2 specifications, ensuring stable electrical performance and long-term structural reliability.

 

Global Availability: Worldwide supply and logistics services are available to support global aerospace and high-frequency electronic projects.

 

F4BTMS265 Material Profile

F4BTMS265 is an upgraded high-reliability ceramic-reinforced PTFE dielectric substrate optimized from the standard F4BTM series. Filled with uniformly distributed nano-ceramic particles and ultra-fine glass fiber, it reduces glass fiber-caused electromagnetic interference, dielectric loss and structural anisotropy. Adopting low-roughness RTF copper foil as standard, it delivers low conductor loss and stable peel strength, and supports copper/aluminum base lamination. With excellent dimensional, thermal and dielectric stability, this aerospace-grade material serves as a high-performance substitute for imported high-frequency substrates in military and aerospace applications.

 

 

Typical Application Fields

Featuring ultra-low dielectric loss, minimal structural anisotropy, superior thermal stability and aerospace-grade reliability, F4BTMS265-based PCBs are well-suited for deployment in high-precision, phase-sensitive high-frequency electronic systems:

 

  • Aerospace devices, space equipment and cabin electronic systems
  • High-frequency RF and microwave circuit systems
  • High-precision military radar equipment
  • Antenna feed network components
  • Phase-sensitive antennas and phased array antenna systems
  • Satellite communication systems

 

Product Tags: Polyimide Stiffener 4 Layer Flex PCB   2 Oz Copper 4 Layer Flex PCB   Polyimide Stiffener 2 Oz Copper PCB  
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