2-layer F4BTMS265 PCB 30mil High-Frequency Substrate
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This 2-layer rigid high-frequency PCB features aerospace-grade F4BTMS265 ceramic-filled dielectric substrate with low electromagnetic loss and minimal anisotropy. It adopts ENIG surface treatment, black top solder mask and white top silkscreen, with a fully mask-free and silkscreen-free bottom side. All units pass 100% electrical testing before delivery, ensuring stable dielectric performance, low signal attenuation and reliable structure for aerospace, military and RF/microwave applications.
PCB Specifications
PCB Layer Stack-up Structure
Artwork & Quality Compliance Production File Standard: Fabricated based on industry-standard Gerber RS-274-X files, supporting high-precision circuit patterning and full compatibility with mainstream industrial manufacturing processes.
Quality Standard: All fabrication and inspection procedures comply strictly with IPC-Class-2 specifications, ensuring stable electrical performance and long-term structural reliability.
Global Availability: Worldwide supply and logistics services are available to support global aerospace and high-frequency electronic projects.
F4BTMS265 Material Profile F4BTMS265 is an upgraded high-reliability ceramic-reinforced PTFE dielectric substrate optimized from the standard F4BTM series. Filled with uniformly distributed nano-ceramic particles and ultra-fine glass fiber, it reduces glass fiber-caused electromagnetic interference, dielectric loss and structural anisotropy. Adopting low-roughness RTF copper foil as standard, it delivers low conductor loss and stable peel strength, and supports copper/aluminum base lamination. With excellent dimensional, thermal and dielectric stability, this aerospace-grade material serves as a high-performance substitute for imported high-frequency substrates in military and aerospace applications.
Typical Application Fields Featuring ultra-low dielectric loss, minimal structural anisotropy, superior thermal stability and aerospace-grade reliability, F4BTMS265-based PCBs are well-suited for deployment in high-precision, phase-sensitive high-frequency electronic systems:
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