F4BTMS233 PCB 2-layer 40mil 1.016mm Thick OSP

Introducing the F4BTMS233 PCB, a premier solution designed for high-reliability applications in demanding environments. As an upgraded version of the F4BTM series, the F4BTMS233 represents a significant advancement in material formulation and manufacturing processes. Engineered with a substantial amount of ceramics and reinforced with ultra-thin and ultra-fine glass fiber cloth, this PCB delivers enhanced performance and a broad range of dielectric constants, making it an ideal choice for aerospace and other critical applications.

Advanced Material Composition

The F4BTMS233 utilizes a unique blend of special nano-ceramics mixed with polytetrafluoroethylene (PTFE) resin, significantly minimizing the negative effects of glass fiber on electromagnetic wave propagation. This innovative formulation reduces dielectric loss while enhancing dimensional stability and decreasing X/Y/Z anisotropy. The result is a material that not only improves electrical strength but also exhibits enhanced thermal conductivity and a low thermal expansion coefficient. Additionally, the material’s stable dielectric temperature characteristics make it suitable for a wide range of operating conditions.

Key Features

- Dielectric Constant (Dk): 2.33 at 10GHz, providing reliable performance in high-frequency applications.
- Dissipation Factor: 0.0010 at 10GHz and 0.0011 at 20GHz, ensuring minimal energy loss.
- Coefficient of Thermal Expansion (CTE): X-axis at 35 ppm/°C, Y-axis at 40 ppm/°C, and Z-axis at 220 ppm/°C, valid from -55°C to 288°C.
- Low Thermal Coefficient of Dk: -122 ppm/°C, maintaining stability from -55°C to 150°C.
- UL-94 V0 Rating: Ensuring compliance with stringent flammability standards.
- Low Moisture Absorption: Just 0.02%, enhancing reliability in various environments.

PCB Stack-Up and Construction Details

The F4BTMS233 PCB features a 2-layer rigid design with the following specifications:

- Copper Layer 1: 35 μm
- F4BTMS233 Core: 1.016 mm (40 mil)
- Copper Layer 2: 35 μm

The board dimensions are set at 40 mm x 108 mm (± 0.15 mm), with a finished board thickness of 1.1 mm. A finished copper weight of 1 oz (1.4 mils) is provided on the outer layers, ensuring optimal conductivity.

Additional construction details include a minimum trace/space of 5/4 mils, a minimum hole size of 0.3 mm, and a via plating thickness of 20 μm. The surface finish is OSP (Organic Solderability Preservative), which offers excellent solderability and environmental protection. The top silkscreen is printed in white, while the top solder mask is a vibrant blue, providing clear component identification.

To guarantee quality, a 100% electrical test is conducted prior to shipment, ensuring that each PCB meets the highest performance standards.

The artwork is supplied in the Gerber RS-274-X format, facilitating seamless integration with standard manufacturing processes.

Quality Assurance

Manufactured in accordance with IPC-Class-2 standards, the F4BTMS233 PCB ensures a moderate level of reliability suitable for consumer electronics and specialized applications. This commitment to quality guarantees a product that consistently meets rigorous performance benchmarks.

Typical Applications

The F4BTMS233 PCB is ideally suited for a variety of applications, including:

- Aerospace Equipment: Perfect for space and cabin equipment requiring high reliability.
 

- Microwave and RF Applications: Suitable for advanced microwave components and RF systems.
 

- Military Radar: Ideal for radar and military applications demanding precision.
 

- Feed Networks and Phase-Sensitive Antennas: Designed for phased array antennas and satellite communications.

Conclusion

Discover the advantages of the F4BTMS233 PCB, engineered for excellence in high-frequency and high-reliability applications. With its advanced material composition, robust construction, and rigorous quality standards, this PCB is poised to meet the demands of modern electronics.