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20mil RO4835 PCB 2 Layer Circuit With Immersion Gold

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Bicheng Electronics Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-755-27374847

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Ms.Ivy Deng
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20mil RO4835 PCB 2 Layer Circuit With Immersion Gold

Brand Name Bicheng
Certification UL, ISO9001, IATF16949
Place of Origin CHINA
Minimum Order Quantity 1PCS
Price USD9.99-99.99/PCS
Payment Terms T/T
Supply Ability 5000PCS per month
Delivery Time 8-9 working days
Packaging Details Vacuum bags+Cartons
Material RO4835 dielectric 20 mil (0.508mm)
Layer count 2-layer
PCB size 77.55mm x 167.5mm=1 PCS, +/- 0.15mm
PCB thickness 0.6mm
Copper weight 1oz (1.4 mils) outer layers
Surface finish Immersion Gold
Detailed Product Description

Introducing the Rogers RO4835 PCB, engineered for high frequency performance and exceptional reliability. This advanced laminate is crafted from Rogers' RO4835 material, which offers enhanced thermal stability and superior oxidation resistance compared to traditional hydrocarbon materials. With properties similar to RO4350B laminates, the RO4835 is perfect for cost-effective circuit fabrication while maintaining high performance standards.

 

Key Features

-RoHS Compliant: Meets environmental standards for applications requiring UL 94 V-0.


-IPC-4103 Compliant: Adheres to industry standards for quality and reliability.


-Dielectric Constant: 3.48 ± 0.05, ensuring controlled impedance for critical applications.


-Dissipation Factor: Low at 0.0037 at 10 GHz, promoting efficient signal transmission.


-Glass Transition Temperature: Exceeds 280 °C, supporting high-temperature applications.


-Coefficient of Thermal Expansion: Low values ensure dimensional stability across axes.

 

PropertyRO4835DirectionUnitsConditionTest Method
Dielectric Constant,εProcess3.48±0.05Z-10 GHz/23℃IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign3.66Z-8 to 40 GHzDifferential Phase Length Method
Dissipation Factortan,δ0.0037Z-10 GHz/23℃IPC-TM-650 2.5.5.5
Thermal Coefficient of ε+50Zppm/℃-100℃to 150℃IPC-TM-650 2.5.5.5
Volume Resistivity5 x 108 MΩ.cmCOND AIPC-TM-650 2.5.17.1
Surface Resistivity7 x108 COND AIPC-TM-650 2.5.17.1
Electrical Strength30.2(755)ZKv/mm(v/mil) IPC-TM-650 2.5.6.2
Tensile Modulus7780(1128)YMPa(ksi)RTASTM D 638
Tensile Strength136(19.7)YMPa(ksi)RTASTM D 638
Flexural Strength186 (27) Mpa (kpsi) IPC-TM-650 2.4.4
Dimensional Stability<0.5X,Ymm/m
(mils/inch)
after etch+E2/150℃IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion10
12
31
X
Y
Z
ppm/℃-55℃to288℃IPC-TM-650 2.4.41
Tg>280 ℃ TMAAIPC-TM-650 2.4.24.3
Td390 ℃ TGA ASTM D 3850
Thermal Conductivity0.66 W/m/oK80℃ASTM C518
Moisture Absorption0.05 %48hrs immersion 0.060"
sample Temperature 50℃
ASTM D 570
Density1.92 gm/cm323℃ASTM D 792
Copper Peel Stength0.88 (5.0) N/mm (pli)after solder float 1 oz.
EDC Foil
IPC-TM-650 2.4.8
FlammabilityV-0   UL 94
Lead-free Process CompatibleYes    

 

Benefits
-Oxidation Resistance: Delivers significantly improved durability over typical thermoset microwave materials.


-Low Loss Performance: Ideal for high-frequency applications, including automotive systems.


-Tight Tolerances: Controlled dielectric constant for precision in transmission lines.


-Lead-Free Compatibility: Ensures no issues with blistering or delamination during processing.


-Stable Dimensions: Low expansion coefficients maintain reliability in plated through holes.

 

PCB Material:Hydrocarbon Ceramic Laminates
Designation:RO4835
Dielectric constant:3.48 (10 GHz)
Dissipation Factor0.0037 (10 GHz)
Layer count:Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight:0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Dielectric thickness (ED copper)6.6mil (0.168mm), 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm)
Dielectric thickness (LoPro copper)4mil (0.102mm), 7.3mil (0.186mm), 10.7mil (0.272mm), 20.7mil (0.526mm), 30.7mil (0.780mm), 60.7mil (1.542mm)
PCB size:≤400mm X 500mm
Solder mask:Green, Black, Blue, Yellow, Red etc.
Surface finish:Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc..

 

 

This PCB is constructed as a 2-layer rigid board, providing a robust platform for high-frequency applications. Each side is finished with 35 μm of copper, ensuring effective conductivity and signal integrity throughout the circuit.

 

The dielectric layer comprises 20 mils (0.508 mm) of RO4835 material, contributing to the PCB's low loss performance. Overall, the board has a total thickness of 0.6 mm, suitable for a wide range of electronic components.

 

For precision manufacturing, the PCB allows for a minimum trace and space of 6/8 mils, along with a minimum hole size of 0.3 mm, enabling complex designs. The surface finish is achieved through immersion gold, enhancing solderability and durability, while the top layer features white silkscreen for clear labeling, leaving the bottom layer free of silkscreen for a streamlined appearance.

 

Artwork and Compliance
 

Artwork Type:Gerber RS-274-X
Accepted Standard: IPC-Class-2

Service Area: Worldwide

 

Typical Applications

The Rogers RO4835 PCB is ideal for:

 

-Automotive Radar and Sensors

-Point-to-Point Microwave Communication

-Power Amplifiers

-Phased-Array Radar Systems

-RF Components

 

Product Tags: Immersion Gold RO4835 PCB   20mil RO4835 PCB   20mil PCB 2 Layer Circuit  
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