3mm Hybrid PCB on Rogers RO3210 and RO3003 Materials 3-layer Circuit

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Bicheng Electronics Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-755-27374847

Contact Person:
Ms.Ivy Deng View Contact Details

3mm Hybrid PCB on Rogers RO3210 and RO3003 Materials 3-layer Circuit

Brand Name	Bicheng
Certification	UL, ISO9001, IATF16949
Place of Origin	CHINA
Minimum Order Quantity	1PCS
Price	USD9.99-99.99/PCS
Payment Terms	T/T
Supply Ability	5000PCS per month
Delivery Time	8-9 working days
Packaging Details	Vacuum bags+Cartons
Material	RO3210 and RO3003
Layer count	3-layer
PCB size	62.8mm x 62.8 mm=1PCS, +/- 0.15mm
PCB thickness	3mm
Copper weight	1oz (1.4 mils) outer layers
Surface finish	Immersion Tin

Detailed Product Description

Introducing our newly shipped hybrid printed circuit board (PCB), designed for high-frequency applications with unmatched performance and reliability. This advanced PCB combines Rogers’ RO3210 and RO3003 materials, providing a unique blend of mechanical stability and excellent electrical characteristics, making it ideal for a wide range of demanding applications.

Key Features

RO3210 Material
- Dielectric Constant (Dk): 10.2 ± 0.5
- Dissipation Factor: 0.0027 at 10 GHz
- Thermal Stability:
- Coefficient of Thermal Expansion (CTE):
- X & Y axes: 13 ppm/°C
- Z axis: 34 ppm/°C
- Decomposition Temperature (Td): 500 °C
- Thermal Conductivity: 0.81 W/mK
- Flammability Rating: V0 (UL 94 standard)

RO3210 Typical Value
Property	RO3210	Direction	Units	Condition	Test Method
Dielectric Constant,εProcess	10.2±0.5	Z		10 GHz 23℃	IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign	10.8	Z		8GHz to 40 GHz	Differential Phase Length Method
Dissipation Factor,tanδ	0.0027	Z		10 GHz 23℃	IPC-TM-650 2.5.5.5
Thermal Coefficient of ε	-459	Z	ppm/℃	10 GHz 0℃to 100℃	IPC-TM-650 2.5.5.5
Dimensional Stability	0.8	X, Y	mm/m	COND A	ASTM D257
Volume Resistivity	10³		MΩ.cm	COND A	IPC 2.5.17.1
Surface Resistivity	10³		MΩ	COND A	IPC 2.5.17.1
Tensile Modulus	579 517	MD CMD	kpsi	23℃	ASTM D 638
Water Absorption	＜0.1	-	%	D24/23	IPC-TM-650 2.6.2.1
Specific Heat	0.79		j/g/k		Calculated
Thermal Conductivity	0.81		W/M/K	80℃	ASTM C518
Coefficient of Thermal Expansion (-55 to 288℃)	13 34	X,Y Z	ppm/℃	23℃/50% RH	IPC-TM-650 2.4.4.1
Td	500		℃	TGA	ASTM D3850
Density	3		gm/cm³
Copper Peel Stength	11		pli	1oz,EDC After Solder Float	IPC-TM 2.4.8
Flammability	V-0				UL 94
Lead-free Process Compatible	Yes

RO3003 Material
- Dielectric Constant (Dk): 3 ± 0.04 at 10 GHz/23°C
- Dissipation Factor: 0.001 at 10 GHz/23°C
- Thermal Stability:
- Td: > 500 °C
- Coefficient of Thermal Expansion:
- X axis: 17 ppm/°C
- Y axis: 16 ppm/°C
- Z axis: 25 ppm/°C
- Moisture Absorption: 0.04%
- Thermal Conductivity: 0.5 W/mK

RO3003 Typical Value
Property	RO3003	Direction	Units	Condition	Test Method
Dielectric Constant,εProcess	3.0±0.04	Z		10 GHz/23℃	IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign	3	Z		8GHz to 40 GHz	Differential Phase Length Method
Dissipation Factor,tanδ	0.001	Z		10 GHz/23℃	IPC-TM-650 2.5.5.5
Thermal Coefficient of ε	-3	Z	ppm/℃	10 GHz -50℃to 150℃	IPC-TM-650 2.5.5.5
Dimensional Stability	0.06 0.07	X Y	mm/m	COND A	IPC-TM-650 2.2.4
Volume Resistivity	10⁷		MΩ.cm	COND A	IPC 2.5.17.1
Surface Resistivity	10⁷		MΩ	COND A	IPC 2.5.17.1
Tensile Modulus	930 823	X Y	MPa	23℃	ASTM D 638
Moisture Absorption	0.04		%	D48/50	IPC-TM-650 2.6.2.1
Specific Heat	0.9		j/g/k		Calculated
Thermal Conductivity	0.5		W/M/K	50℃	ASTM D 5470
Coefficient of Thermal Expansion (-55 to 288℃)	17 16 25	X Y Z	ppm/℃	23℃/50% RH	IPC-TM-650 2.4.4.1
Td	500		℃ TGA		ASTM D 3850
Density	2.1		gm/cm³	23℃	ASTM D 792
Copper Peel Stength	12.7		Ib/in.	1oz,EDC After Solder Float	IPC-TM 2.4.8
Flammability	V-0				UL 94
Lead-free Process Compatible	Yes

PCB Specifications

- Stackup: 3-layer rigid PCB

- Copper Layer 1: 35 μm
- Rogers RO3003 Core: 1.524 mm (60 mil)
- RO4450F Bondply: 0.101 mm (4 mil)
- Rogers RO3210 Core: 1.27 mm (50 mil)
- Copper Layer 1: 35 μm

- Dimensions: 62.8 mm x 62.8 mm ± 0.15 mm
- Finished Board Thickness: 3.0 mm
- Finished Copper Weight: 1 oz (1.4 mils) on outer layers
- Minimum Trace/Space: 7/9 mils
- Minimum Hole Size: 0.4 mm
- Via Plating Thickness: 20 μm
- Surface Finish: Immersion Tin
- Electrical Testing: 100% electrical test prior to shipment

Application Areas

This hybrid PCB is tailored for various high-performance applications, including:

- Automotive Technologies: Collision avoidance systems and global positioning satellite antennas
- Telecommunications: Wireless systems, microstrip patch antennas, and direct broadcast satellites
- Remote Monitoring: Datalink on cable systems and remote meter readers
- Infrastructure Solutions: Power backplanes, LMDS, wireless broadband, and base station infrastructure

Quality Assurance

Manufactured to IPC-Class 2 standards, this PCB ensures high reliability and performance. The artwork is provided in Gerber RS-274-X format, making it compatible with standard PCB design tools.

Global Availability

Our hybrid PCB is available for worldwide shipping, allowing you to leverage cutting-edge technology in your projects, no matter your location.

Product Tags: RO3210 Hybrid PCB 3mm Hybrid PCB RO3003 Hybrid PCB

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