China RF PCB Board manufacturer
Bicheng Electronics Technology Co., Ltd
We Are Your RF PCB Solution Provider! Rogers PCB, Taconic PCB, Arlon PCB, F4B PCB ISO9001, ISO14001, IATF 16949 certified
6
Home > Products > High Speed PCB >

RT / Duroid 6006 2 layer board Solution For Low Loss Circuit Projects

Browse Categories

Bicheng Electronics Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-755-27374847

Contact Person:
Ms.Ivy Deng
View Contact Details

RT / Duroid 6006 2 layer board Solution For Low Loss Circuit Projects

Brand Name Bicheng
Certification UL, ISO9001, IATF16949
Place of Origin CHINA
Minimum Order Quantity 1PCS
Price USD9.99-99.99/PCS
Payment Terms T/T
Supply Ability 5000PCS per month
Delivery Time 8-9 working days
Packaging Details Vacuum bags+Cartons
Material RT/duroid 6006
PCB size 65.33mm x 59.89 mm=1PCS, +/- 0.15mm
Copper weight 1oz (1.4 mils) outer layers
Surface finish Immersion silver
Layer count 2-Layer
PCB Thickness 0.7 mm
Detailed Product Description

In the rapidly advancing world of electronics, the need for high-performance printed circuit boards (PCBs) is paramount. The RT/duroid 6006 PCB stands out as an exceptional solution for microwave and electronic circuit applications, designed specifically to meet the demands of high-frequency environments. This article delves into the features, specifications, and advantages of the RT/duroid 6006, emphasizing its importance in modern circuit design.

 

Material Composition and Characteristics
The RT/duroid 6006 is a ceramic-PTFE composite that provides outstanding dielectric properties. With a dielectric constant (Dk) of 6.15 ± 0.15 at 10 GHz, it enables significant reductions in circuit size while maintaining performance. This high Dk allows engineers to design compact circuits without compromising functionality.

 

Key Electrical Properties
Dissipation Factor: The RT/duroid 6006 boasts a low dissipation factor of 0.0027, ensuring minimal signal loss during operation. This characteristic is crucial for applications that demand high efficiency, particularly in RF and microwave circuits.

 

Thermal Stability: With a thermal stability exceeding 500 °C, the RT/duroid 6006 can withstand extreme temperatures, making it suitable for demanding environments. Its thermal coefficient of dielectric constant is -410 ppm/°C, indicating stable performance across a wide temperature range (-50°C to 170°C).
 

Moisture Absorption: The PCB exhibits a moisture absorption rate of just 0.05%, enhancing its reliability, especially in humid conditions. This low moisture absorption contributes to the longevity and performance consistency of the circuits.

 

PropertyRT/duroid 6006DirectionUnitsConditionTest Method
Dielectric Constant,εProcess6.15±0.15Z 10 GHz/23℃IPC-TM-650 2.5.5.5 Clamped stripline
Dielectric Constant,εDesign6.45Z 8GHz to 40 GHzDifferential Phase Length Method
Dissipation Factor,tanδ0.0027Z 10 GHz/AIPC-TM-650 2.5.5.5
Thermal Coefficient of ε-410Zppm/℃-50℃-170℃IPC-TM-650 2.5.5.5
Volume Resistivity7 x 107 Mohm.cmAIPC 2.5.17.1
Surface Resistivity2 x 107 MohmAIPC 2.5.17.1
Tensile PropertiesASTM D638 (0.1/min. strain rate)
Young's Modulus627(91) 517(75)X YMPa(kpsi)A
Ultimate Stress20(2.8) 17(2.5)X YMPa(kpsi)A
Ultimate Strain12 to 13 4 to 6X Y%A
Compressive Properties ASTM D695 (0.05/min. strain rate)
Young's Modulus1069 (115)ZMPa(kpsi)A
Ultimate Stress54(7.9)ZMPa(kpsi)A
Ultimate Strain33Z% 
Flexural Modulus2634 (382) 1951 (283)XMPa(kpsi)AASTM D790
Ultimate Stress38 (5.5)X YMPa(kpsi)A
Deformation under load0.33 2.1Z Z%24hr/50℃/7MPa 24hr/150℃/7MPaASTM D261
Moisture Absorption0.05 %D48/50℃ 0.050"(1.27mm) thickIPC-TM-650 2.6.2.1
Thermal Conductivity0.49 W/m/k80℃ASTM C518
Coefficient of Thermal Expansion47
34
117
X
Y
Z
ppm/℃23℃/50% RHIPC-TM-650 2.4.41
Td500 ℃ TGA ASTM D3850
Density2.7 g/cm3 ASTM D792
Specific Heat0.97(0.231) j/g/k
(BTU/ib/OF)
 Calculated
Copper Peel14.3 (2.5) pli (N/mm)after solder floatIPC-TM-650 2.4.8
FlammabilityV-0   UL 94
Lead-free Process CompatibleYes    

 

Mechanical Properties
 

The mechanical characteristics of the RT/duroid 6006 further enhance its applicability:

Young's Modulus: With values of 627 MPa in the X-direction and 517 MPa in the Y-direction, the material provides robust mechanical strength.
 

Ultimate Stress: The ultimate stress values of 20 MPa (X) and 17 MPa (Y) indicate its capacity to withstand significant mechanical loads.
 

Coefficient of Thermal Expansion (CTE): The CTE values are 47 ppm/°C (X), 34 ppm/°C (Y), and 117 ppm/°C (Z), ensuring dimensional stability across varying temperatures.

 

PCB Construction and Specifications
This PCB features a well-engineered construction:

Stackup: 2-layer rigid PCB
Copper Layer 1: 35 μm
RT/duroid 6006 Core Thickness: 0.635 mm (25 mil)
Copper Layer 2: 35 μm
Dimensions: 65.33 mm x 59.89 mm (±0.15 mm)
Finished Thickness: 0.7 mm
Surface Finish: Immersion Silver, enhancing solderability and protecting the copper layers.

 

This PCB supports a minimum trace/space of 5/5 mils and a minimum hole size of 0.5 mm, providing flexibility in design and manufacturing.

 

Advantages of RT/duroid 6006 PCBs
The RT/duroid 6006 offers a plethora of advantages:

High Dielectric Constant: Facilitates compact designs without sacrificing performance.
Low Loss Characteristics: Ideal for high-frequency applications, ensuring reliable signal transmission.
Reliable Plated Through-Holes: Enhances connectivity and mechanical integrity in multi-layer board designs.

 

PCB Material:Ceramic-PTFE Composites
Designation:RT/duroid 6006
Dielectric constant:6.15
Dissipation Factor0.0027 10GHz
Layer count:Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight:0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness:10mil(0.254mm), 25mil (0.635mm), 50mil (1.27mm), 75mil (1.905mm), 100mil(2.54mm)
PCB size:≤400mm X 500mm
Solder mask:Green, Black, Blue, Yellow, Red etc.
Surface finish:Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc..

 

 

Diverse Applications Across Industries
The versatility of the RT/duroid 6006 PCB makes it suitable for various applications, including:

 

Patch Antennas: Perfect for compact designs in wireless communication.
Satellite Communications Systems: Provides reliable signal transmission in space applications.
Power Amplifiers: Enhances performance in RF and microwave circuits.
Aircraft Collision Avoidance Systems: Critical for safety and reliability in aviation technology.
Ground Radar Warning Systems: Ensures accurate information in defense applications.

 

Quality Assurance and Standards
Each PCB undergoes rigorous testing, including a 100% electrical test prior to shipment, adhering to IPC-Class-2 standards. This commitment to quality ensures that every unit delivered meets the highest performance criteria.

 

Conclusion
The RT/duroid 6006 PCB represents a significant advancement in PCB technology, offering unmatched performance for high-frequency applications. Its exceptional dielectric properties, mechanical strength, and reliability make it an essential choice for engineers and designers in various industries. By integrating RT/duroid 6006 into your projects, you can maximize performance, reliability, and efficiency, paving the way for innovation in microwave and electronic circuit design. Explore the possibilities with RT/duroid 6006 and elevate your designs to new heights!

Product Tags: RT 2 layer board   Duroid 6006 2 layer board   Low Loss Circuit Projects board  
Related Products
Email to this supplier
 
From:
Enter your Email please.
To: Bicheng Electronics Technology Co., Ltd
Subject:
Message:
Characters Remaining: (80/3000)