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M6 High Speed Low Loss PCB 6-layer 1.4mm Thick ENEPIG Finish

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Bicheng Electronics Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-755-27374847

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Ms.Ivy Deng
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M6 High Speed Low Loss PCB 6-layer 1.4mm Thick ENEPIG Finish

Brand Name Bicheng
Certification UL, ISO9001, IATF16949
Place of Origin China
Minimum Order Quantity 1PCS
Price USD9.99-99.99/PCS
Payment Terms T/T
Supply Ability 5000PCS per month
Delivery Time 8-9 working days
Packaging Details Vacuum bags+Cartons
PCB material M6 Core R5775G(HVLP) 500 μm;
Layer count 6-layer
PCB thickness 1.4mm
PCB size 81.9 mm x 53.7 mm=1PCS, +/- 0.15mm
Copper weight 1oz (1.4 mils) outer layers, 0.5oz inner layers
Surface finish Electroless Nickle Electroless Palladium Immersion Gold (ENEPIG)
Detailed Product Description

This 6-layer PCB crafted from high-performance Megtron6 (M6) R-5775G. Engineered for high-speed, low-loss applications, it is ideal for cutting-edge technologies such as 5G communication, automotive electronics, and high-performance computing.

 

Construction Details

This 6-layer PCB is meticulously engineered to meet the rigorous demands of today’s electronic devices. Here are the key construction details:

 

- Base Material: Megtron6 (M6) - R5775G (HVLP)
- Layer Count: 6 layers, allowing for complex circuit designs.
- Board Dimensions: 81.9 mm x 53.7 mm, with a tolerance of ±0.15 mm, ensuring precise fit in device enclosures.
- Minimum Trace/Space: 4/5 mils, facilitating high-density layouts.
- Minimum Hole Size: 0.3 mm, accommodating various component types.
- Finished Board Thickness: 1.4 mm, optimized for durability.
- Surface Finish: Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG), providing excellent solderability and corrosion resistance.

 

PropertyUnitsTest MethodConditionTypical Value
THERMALGlass Transition Temp ( Tg )CDSCAs received185
 DMAAs received210
Thermal Decomposition TempCTGAAs received410
Time to Delam (T288)Without CuMinIPC TM-650 2.4.24.1As received> 120
With CuMinIPC TM-650 2.4.24.1As received> 120
CTE : α1X - axis ppm / Cppm / CIPC TM-650 2.4.24< Tg14 - 16
Y - axis ppm / Cppm / CIPC TM-650 2.4.24< Tg14 - 16
Z - axis ppm / Cppm / CIPC TM-650 2.4.24< Tg45
CTE : α2Z - axis ppm / Cppm / CIPC TM-650 2.4.24> Tg 260260
ELECTRICALVolume ResistivityMΩ - cmIPC TM-650 2.5.17.1C-96/35/901 x 109
Surface ResistivityMΩIPC TM-650 2.5.17.1C-96/35/901 x 108
Dielectric Constant ( Dk )@ 1GHz/IPC TM-650 2.5.5.9C-24/23/503.71
@ 10GHz/IPC TM-650 2.5.5.5C-24/23/503.61
Dissipation Factor ( Df )@ 1GHz/IPC TM-650 2.5.5.9C-24/23/500.002
@ 10GHz/IPC TM-650 2.5.5.5C-24/23/500.004
PHYSICALWater Absorption%IPC TM-650 2.6.2.1D-24/230.14
Peel Strength1oz ( H-VLP )kN / mIPC TM-650 2.4.8As Received 0.80.8
Flammability/ULC-48/23/5094V-0

 

Stackup Configuration

The stackup of our PCB is designed for optimal performance in high-frequency applications:

 

Copper Layers: Multiple layers of copper ranging from 17 μm to 35 μm, strategically placed for effective signal transmission.


Prepreg Materials: R-5670(G) prepregs provide stability and insulation between copper layers.


Core Material: M6 Core R5775G (HVLP) ensures low dielectric loss and high thermal reliability.

 

 

Advantages of Megtron6 (M6) R-5775G

 

High-Speed Performance
Megtron6 laminate is specifically formulated for high-frequency applications. With a dielectric constant of 3.4 at 1 GHz and 3.34 at 13 GHz, it minimizes signal loss, making it ideal for 5G communications and other high-speed technologies.

 

Low Dielectric Loss
The dissipation factor of 0.002 at 1 GHz and 0.0037 at 13 GHz ensures that energy is efficiently transmitted, reducing heat generation and improving overall performance.

 

Thermal Reliability
The high Tg value (>185 °C) and thermal decomposition temperature (Td) of 410 °C make this PCB suitable for environments with significant thermal challenges, such as automotive and aerospace applications.

 

Environmental Compliance
This PCB is RoHS compliant and halogen-free, aligning with global standards for green manufacturing. This commitment to sustainability is crucial for modern electronic design.

 

PCB Material:Low DK Glass Cloth
Designation:Laminate R-5775(G), Prepreg R-5670(G)
Dielectric constant:3.61 10GHz
Dissipation Factor0.004 10GHz
Layer count:Multilayer PCB, Hybrid PCB
Copper weight:0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness:0.4mm, 0.6mm, 0.8mm, 1.0mm, 1.6mm, 1.8mm, 2.0mm
PCB size:≤400mm X 500mm
Solder mask:Green, Black, Blue, Yellow, Red etc.
Surface finish:Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc..

 

Typical Applications

5G Communication: Base stations, millimeter-wave antennas, RF front-ends

 

Automotive Electronics: 77 GHz radar systems, ADAS


Data Centers: High-speed server motherboards, optical module PCBs


Aerospace: Circuit boards for satellite communication and radar


Consumer Electronics: Wi-Fi 6E/7 routers, AR/VR devices

 

Conclusion
This PCB with Megtron6 material is a pivotal component in the landscape of modern electronics. From high-speed communication to automotive safety systems, its advanced features and materials provide the foundation for innovative designs. As technology continues to advance, this PCB stands ready to meet the challenges of tomorrow’s high-performance applications. Embrace the future of electronics with our sophisticated, reliable, and environmentally responsible PCB solutions.

 

Product Tags: Low Loss PCB 6-layer   M6 PCB 6-layer   ENEPIG Finish 6 layer pcb  
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