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PTFE Composite Material High Frequency PCB Board DiClad 527

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Bicheng Electronics Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-755-27374847

Contact Person:
Ms.Ivy Deng
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PTFE Composite Material High Frequency PCB Board DiClad 527

Brand Name Bicheng
Certification UL, ISO9001, IATF16949
Place of Origin China
Minimum Order Quantity 1PCS
Price USD9.99-999.99
Payment Terms T/T
Supply Ability 5000PCS per month
Delivery Time 8-9 working days
Packaging Details Vacuum bags+Cartons
Standard Panel Sizes 18" x 12" (457 x 305mm) 18" x 24" (457 x 610mm)
Standard Thicknesses 0.020" (0.508mm) with a tolerance of +/- 0.0020" 0.030" (0.762mm) with a tolerance of +/- 0.0020" 0.060" (1.524mm) with a tolerance of +/- 0.0020"
Electrodeposited Copper Foil 1/2 oz. (18µm) 1 oz. (35µm)
Dk range 2.40 to 2.60
Detailed Product Description

Substrate Introduction

Rogers DiClad 527 laminates are composite materials reinforced with woven fiberglass for use as substrates in printed circuit boards. These laminates offer a higher proportion of fiberglass reinforcement compared to PTFE content. This carefully balanced ratio results in a wider range of dielectric constant (Dk) and improved dimensional stability and registration.

 

Standard Panel Sizes for DiClad 527:

18" x 12" (457 x 305mm)

18" x 24" (457 x 610mm)

 

Standard Thicknesses for DiClad 527:

0.020" (0.508mm) with a tolerance of +/- 0.0020"

0.030" (0.762mm) with a tolerance of +/- 0.0020"

0.060" (1.524mm) with a tolerance of +/- 0.0020"

 

Standard Claddings for DiClad 527:

Electrodeposited Copper Foil

1/2 oz. (18µm)

1 oz. (35µm)

 

For information on other available PCB configurations, such as additional thicknesses, panel sizes, and claddings, please contact our Customer Service or Sales Engineering teams.

 

Key Features:

1. Dk range: 2.40 to 2.60

2. Low dissipation factor: .0018 at 10GHz

3. Low moisture absorption

 

Key Benefits:

1. Stable Dk across a wide frequency range

2. Low circuit losses at high frequencies

3. Minimal performance variation in high humidity environments

4. Excellent dimensional stability

5. Consistent product performance

6. Uniform electrical properties across frequencies

7. Reliable mechanical performance

8. Excellent chemical resistance

 

Our PCB Capability (DiClad 527)

PCB Material:Woven Fiberglass/PTFE composite
Designation:DiClad 527
Dielectric constant:2.40-2.60 10GHz/23˚C
Dissipation factor0.0017 10GHz/23˚C
Layer count:Single Sided, Double Sided, Multi-layer PCB, Hybrid PCB
Copper weight:1oz (35µm), 2oz (70µm)
Dielectric thickness20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm)
PCB size:≤400mm X 500mm
Solder mask:Green, Black, Blue, Yellow, Red etc.
Surface finish:Immersion gold, HASL, Immersion silver, Immersion tin, ENEPIG, OSP, Bare copper, Pure gold etc..

 

 

Typical Applications:

1. Radar feed networks

2. Commercial phased array networks

3. Low-loss base station antennas

4. Guidance systems

5. Digital radio antennas

6. Filters, couplers, and LNAs

 

DiClad 527 Data Sheet

PropertiesDiClad 527UnitsTest ConditionsTest Method
Electrical Properties     
Dielectric Constant2.40-2.60-23˚C @ 50% RH10 GHzIPC TM-650 2.5.5.5
Dielectric Constant2.40-2.60-23˚C @ 50% RH1 MHzIPC TM-650 2.5.5.3
Dissapation Factor0.0017 23˚C @ 50% RH10 GHzIPC TM-650 2.5.5.5
Dissapation Factor0.0010 23˚C @ 50% RH1 MHzIPC TM-650 2.5.5.3
Thermal Coefficient of Dielectric
Constant
-153ppm/˚C-10 to 140˚C10 GHzIPC TM-650 2.5.5.5
Volume Resistivity1.2 x 109MΩ-cmC96/35/90-IPC TM-650 2.5.17.1
Surface Resistivity4.5 x 107C96/35/90-IPC TM-650 2.5.17.1
Dielectric Breakdown>45kVD48/50-ASTM D-149
Arc Resistance
 
>180 --ASTM D-495
Thermal Properties     
Coefficient of Thermal Expansion - x14ppm/˚C-50˚C to 150˚CIPC TM-650 2.4.41
Coefficient of Thermal Expansion - y21ppm/˚C-50˚C to 150˚CIPC TM-650 2.4.41
Coefficient of Thermal Expansion - z173ppm/˚C-50˚C to 150˚CIPC TM-650 2.4.24
Thermal Conductivity0.26W/(m.K)  ASTM E1461
Mechanical Properties     
Copper Peel Strength14Lbs/in10s @288˚C35 μm foilIPC TM-650 2.4.8
Young’s Modulus517, 706kpsi23˚C @ 50% RH-ASTM D-638
Tensile Strength (MD, CMD)19.0, 15.0kpsi23˚C @ 50% RH-ASTM D-882
Compressive Modulus359kpsi23˚C @ 50% RH-ASTM D-695
Flex Modulus
 
537kpsi23˚C @ 50% RH ASTM D-3039
Physical Properties     
FlammabilityV-0  C48/23/50 &
C168/70
UL 94
Moisture Absorption0.03%E1/105+D24/23 IPC TM-650 2.6.2.2
Density231g/cm³C24/23/50Method AASTM D792
NASA
Outgassing
Total Mass Lost0.02%125°C, ≤ 10-6 torrNASA SP-R-0022A
Collected Volatiles0.00%
Water Vapor Recovered0.01%

 

 

Product Tags: 18" x 12" RF PCB Board   PTFE Composite High Frequency PCB Board  
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