RF PCB 1.27mm 2 Layer Circuit Boards 50mil AD1000 Immersion Gold

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Bicheng Electronics Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-755-27374847

Contact Person:
Ms.Ivy Deng View Contact Details

RF PCB 1.27mm 2 Layer Circuit Boards 50mil AD1000 Immersion Gold

Brand Name	Bicheng
Model Number	BIC-6.V1.0
Certification	UL, ISO9001, IATF16949
Place of Origin	CHINA
Minimum Order Quantity	1PCS
Price	USD9.99-99.99
Payment Terms	T/T
Supply Ability	5000PCS per month
Delivery Time	8-9 working days
Packaging Details	Vacuum bags+Cartons
Based material	AD1000
Layer count	2L
Thickness	50mil
Surface	Immersion Gold

Detailed Product Description

50mil AD1000 Immersion Gold RF PCB 1.27mm 2 Layer Circuit Boards

This style of PTFE/woven fiberglass/ceramic filled laminate AD1000 material is used to create immersion gold RF PCBs. The circuit board has finished 1oz copper in two layers. No silkscreen and solder mask. The layer is completely exposed in air. It is 50 vacuum-packed boards and the board thickness is 0.8mm.

AD1000 is widely use in Aircraft Collision Avoidance Systems (TCAS), Ground Based Radar Surveillance Systems, Low Noise Amplifiers (LNAs), Miniaturized Circuitry & Patch Antennas, Power Amplifiers (PAs), Radar Modules and Manifolds and X-Band and Below.

Typical property of AD1000

Property	Units	Value	Test Method
1. Electrical Properties
Dielectric Constant (may vary by thickness)
@1 MHz	-		IPC TM-650 2.5.5.3
@ 10 GHz	-	10.2	IPC TM-650 2.5.5.5
Dissipation Factor
@ 1 MHz	-		IPC TM-650 2.5.5.3
@ 10 GHz	-	0.0023	IPC TM-650 2.5.5.5
Temperature Coefficient of Dielectric	-
TCεr @ 10 GHz (-40-150°C)	ppm/℃	-380	IPC TM-650 2.5.5.5
Volume Resistivity
C96/35/90	MΩ-cm	1.40x10⁹	IPC TM-650 2.5.17.1
E24/125	MΩ-cm	5.36x10⁷	IPC TM-650 2.5.17.1
Surface Resistivity
C96/35/90	MΩ	1.80x10⁹	IPC TM-650 2.5.17.1
E24/125	MΩ	3.16x10⁸	IPC TM-650 2.5.17.1
Electrical Strength	Volts/mil (kV/mm)	622 (24.5)	IPC TM-650 2.5.6.2
Dielectric Breakdown	kV	>45	IPC TM-650 2.5.6
Arc Resistance	sec	>180	IPC TM-650 2.5.1
2. Thermal Properties
Decomposition Temperature (Td)
Initial	℃	>500	IPC TM-650 2.4.24.6
5%	℃	>500	IPC TM-650 2.4.24.6
T260	min	>60	IPC TM-650 2.4.24.1
T288	min	>60	IPC TM-650 2.4.24.1
T300	min	>60	IPC TM-650 2.4.24.1
Thermal Expansion, CTE (x,y) 50-150ºC	ppm/℃	8, 10	IPC TM-650 2.4.41
Thermal Expansion, CTE (z) 50-150ºC	ppm/℃	20	IPC TM-650 2.4.24
% z-axis Expansion (50-260ºC)	%		IPC TM-650 2.4.24
3. Mechanical Properties
Peel Strength to Copper (1 oz/35 micron)
After Thermal Stress	lb/in (N/mm)	>12 (2.1)	IPC TM-650 2.4.8
At Elevated Temperatures (150º)	lb/in (N/mm)	13.6 (2.4)	IPC TM-650 2.4.8.2
After Process Solutions	lb/in (N/mm)		IPC TM-650 2.4.8
Young’s Modulus	kpsi (GPa)	200 (1.38)	IPC TM-650 2.4.18.3
Flexural Strength (Machine/Cross)	kpsi (MPa)	9.9/7.5 (68/52)	IPC TM-650 2.4.4
Tensile Strength (Machine/Cross)	kpsi (MPa)	5.1/4.3 (35/30)	IPC TM-650 2.4.18.3
Compressive Modulus	kpsi (GPa)	>425 (>2.93)	ASTM D-3410
Poisson’s Ratio	-	0.16	ASTM D-3039
4. Physical Properties
Water Absorption	%	0.03	IPC TM-650 2.6.2.1
Density, ambient 23ºC	g/cm³	3.20	ASTM D792 Method A
Thermal Conductivity	W/mK	0.81	ASTM E1461
Flammability	class	Meets V0	UL-94
NASA Outgassing, 125ºC, ≤10-6 torr	%		NASA SP-R-0022A
Total Mass Loss	%	0.01	NASA SP-R-0022A
Collected Volatiles	%	0.00	NASA SP-R-0022A
Water Vapor Recovered	%	0.00	NASA SP-R-0022A

Product Tags: AD1000 RF PCB Board 1.27mm RF Circuit Boards Immersion Gold PCB Circuit Boards

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