High Temperature 8-Layer FR4 PCB Board For Satellite Radio
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Detailed Product Description
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Via in Pad PCB High Temperature VIP PCB 8-Layer Circuit Board on
FR-4 with Immersion Gold for Satellite Radio 1.1 General description This is a type of 8 layer printed circuit board built on FR-4 Tg170
substrate for the application of Satellite Radio. It's 1.6 mm thick
with white silkscreen(Taiyo) on green solder mask (Taiyo) and
immersion gold on pads. The base material is from Taiwan ITEQ
supplying 1 up PCB per panel. Vias with 0.2mm are resin filled and
capped (via in pad). They're fabricated per IPC 6012 Class 2 using
supplied Gerber data. Each 25 panels are packed for shipment. 1.2 Features and benefits (1) RoHS compliant and suitable for high thermal reliability needs (2) High solderability, no stressing of circuit boards and less
contamination of PCB surface. (3) Delivery on time. Higher than 98% on-time-delivery rate. (4) 30000 square meter month capability (5) More than 15 years of experience (6) Volume Production capability 1.3 Applications (1) Satellite Communication (2) Solar Panel Inverter (3) Embedded Processor 1.4 Parameter and data sheet
1.5 Design For Manufacture (3)
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| Product Tags: Satellite Radio FR4 PCB Board 8 Layer FR4 PCB Board FR4 8 Layer PCB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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