This custom 4-layer Rogers high-frequency PCB adopts a symmetrical
stack-up: two pieces of 0.508mm RO3210 cores bonded by 0.2mm
RO4450F prepreg. The finished pressed thickness reaches 1.22mm.
Both outer and inner layers use 1oz finished copper, supporting
consistent high-frequency signal transmission. Sized at 79mm × 79mm
for 1 piece, the board is bare on both sides with no solder mask
and no silkscreen. It is finished with silver plating plus gold
plating to deliver excellent conductivity and anti-tarnish
performance. Custom depth-controlled slot are machined to meet
special RF circuit structural requirements. Built entirely with
Rogers high-frequency materials, this PCB maintains stable
electrical performance and reliable mechanical properties for
microwave and RF applications.
PCB Specifications
This 4-layer PCB uses all Rogers material stack-up. RO3210 cores
form the circuit layers, while RO4450F prepreg acts as the bonding
film between inner layers. Precision lamination and custom
depth-controlled grooving are applied for advanced RF circuit
designs.
| Specification Item | Parameter Details |
| Layer Configuration | 4-layer rigid PCB |
| Stackup Structure | 0.508mm RO3210 + 0.2mm RO4450F PP + 0.508mm RO3210 |
| Pressed Overall Thickness | 1.22mm |
| Copper Weight | 1oz outer layer / 1oz inner layer |
| Board Dimension & Quantity | 79mm × 79mm, 1PCS |
| Surface Treatment | Silver plating + Gold plating |
| Solder Mask & Silkscreen | Dual-sided: No solder mask, No silkscreen |
| Custom Structure | Depth-controlled slot |
Rogers RO3210 Material Introduction
RO3210™ high frequency circuit materials are ceramic-filled
laminates reinforced with woven fiberglass. Engineered to deliver
excellent electrical performance and mechanical stability at
competitive pricing, RO3210 belongs to the RO3200™ series, an
enhanced extension of the RO3000® series with upgraded mechanical
stability.
The RO3200 series combines the smooth surface of non-woven PTFE
laminates for tighter line etching tolerances, paired with the
rigidity of woven-glass PTFE substrates. Fabrication follows
standard PTFE PCB processing techniques, as outlined in the
official fabrication guideline “Fabrication Guidelines for RO3000
Series High Frequency Circuit Materials”. RO3210 features a
dielectric constant of 10.2 and a dissipation factor of 0.0027.
RO3200 series laminates are manufactured under an ISO 9002
certified quality system.
Core Material Benefits
- Enhanced mechanical stability compared with classic RO3000 series
materials
- Smooth laminate surface enables tighter etching tolerance for fine
circuit traces
- Dk=10.2 and low dissipation factor (0.0027), minimizing
high-frequency signal loss
- ISO 9002 certified manufacturing ensures consistent batch
performance
- Compatible with standard PTFE PCB fabrication processes
- RO4450F prepreg provides reliable bonding for multi-layer Rogers
stackup
Typical Applications
Thanks to stable dielectric properties and improved mechanical
rigidity, this RO3210 4-layer PCB is widely used in commercial
microwave and RF systems:
- Automotive collision avoidance systems
- Automotive GPS satellite antennas
- Wireless telecommunications systems
- Microstrip patch antennas for wireless communications
- Direct broadcast satellites
- Datalink on cable systems
- Remote meter readers
- Power backplanes
- LMDS and wireless broadband
- Base station infrastructure
Conclusion
This custom 4-layer Rogers PCB uses a symmetrical stackup of RO3210
cores bonded with RO4450F prepreg. 1oz copper is applied on both
inner and outer layers. The board has bare top and bottom sides
without solder mask or silkscreen, finished with silver and gold
plating. Custom depth-controlled slot are machined for specialized
RF designs. RO3210 brings improved mechanical stability, precise
etching capability and low high-frequency loss. This all-Rogers
multilayer PCB is a reliable solution for automotive radar,
satellite antennas, wireless broadband and base station
infrastructure projects.
