China Sapphire Optical Window manufacturer
Chongqing Silian Optoelectronic Science & Technology Co., Ltd.
Chongqing Silian Optoelectronic Science & Technology Co., Ltd.
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100mm 4 Inch Single Crystal Sapphire Wafer High Mechanical Strength

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Chongqing Silian Optoelectronic Science & Technology Co., Ltd.

City: chongqing

Province/State:chongqing

Country/Region:china

Tel:86--4008310499

Contact Person:
Ms.Wu
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100mm 4 Inch Single Crystal Sapphire Wafer High Mechanical Strength

Brand Name Silian
Model Number Customized
Certification SGS/ ISO
Place of Origin Chongqing,China
Minimum Order Quantity 500pcs
Price Negotiable
Payment Terms Western Union, T/T, MoneyGram
Supply Ability 20,000 pcs/month
Delivery Time 5-8 weeks
Packaging Details 1pcs/12pcs/25 pcs
Name 4 Inch Sapphire Substrate
purity ≥99.998%
Front Side Surface Mirror polished , EPI-Ready
Orientation C plane tiled M axis 0.20°±0.1°
Color Colorless and transparent
Back side Roughness 0.8-1.2um
Diameter 100 ± 0.15mm
Thickness 650 ± 20um
Detailed Product Description

4 Inch Sapphire Substrate Is Widely Used

 

Product Description

The epitaxial layers of GaN-based materials and devices are mainly grown on sapphire substrates. Sapphire substrate has many advantages: firstly, the production technology of sapphire substrate is mature and the device quality is good; secondly, sapphire is very stable and can be used in the high-temperature growth process; finally, sapphire has high mechanical strength and is easy to handle And cleaning. Therefore, most processes generally use sapphire as the substrate.

 

Technical Specification

 

Item4"Unit
DimensionDiameter:100 ± 0.15mm
Thickness:650 ± 20um
Primary Flat:30+1.0mm
OrientationSurface-cut:C plane : Tilt 0.2°±0.1° in M axis /~
Primary Flat:A plane : 0° ± 0.15°~
FlatnessBow:0 ~ (-10)um
Warp:≤ 20um
Total Thickness Variation (TTV):≤ 10um
LTV≤2.5um
Front side Roughness≤0.2nm
Back side Roughness0.8-1.2um
CleanlinessNo particles and fingerprints~
4.Material QualityHigh-purity mono-crystal Al2O3~
5.PackageWafers are packed in cleaned wafer cassettes containing 25 wafers under clean room environment.~
6.Trace AbilityWafers shall be traceable with respect to cassette number. The wafer box should be marked with a removable label showing the date, the cassette number and the quantity.~
7.Laser MarkFront or Back side~

 

Working principle

 

The working principle of the LED is that in the case of forward conduction, the electrons and holes injected into the P/N section of the diode meet and recombine, and the potential energy is converted into light energy. The wavelength of the emitted photons (that is, the color of light) is determined by the energy band width of the semiconductor. The current blue and green LED devices are based on group III nitride semiconductors, which is mainly GaN, and InNAlN is the supplementary four. Yuan AlGaInN alloy system.

To epitaxially grow a GaN film on a sapphire substrate, firstly a two-step epitaxial GaN buffer layer on the substrate (low-temperature epitaxial GaN nucleation layer, then high-temperature epitaxial u-GaN buffer layer); the second step is to grow Si-doped n-GaN The third step is to grow a multifunctional quantum well to provide a radiation recombination center, allowing electrons and holes to recombine and emit light; the fourth step to grow a Mg-doped p-GaN layer to provide hole injection. Normally, the LED structure is as shown in the picture.

 

 

Product Tags: SGS 4 Inch single crystal sapphire wafer   SGS 100mm single crystal sapphire wafer   SGS 4 inch sapphire wafer  
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