China Laser Direct Imaging Machine manufacturer
Jiangsu GIS Laser Technologies Inc.,
Jiangsu GIS Laser Technologies Inc.,
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LDI Roll To Roll Direct Imaging PCB 380V Three Phase

LDI Roll To Roll Direct Imaging PCB 380V Three Phase

Brand Name GIS
Model Number RTR315
Certification ISO 9001 CE
Place of Origin Jiangsu, China
Minimum Order Quantity 1 set
Price negotiable price
Supply Ability 30set per month
Delivery Time 20 work days
Packaging Details wooden case packing
Name laser Direct Imaging (LDI)
Application PCB HDI FPC
Exposure Size Max 260*810mm
Line Width 15μ
Line Line Distance 10%
Line Width tolerance 10%
Alignment Capability 12/24μm
Laser Type LD Laser, 405±5nm
Efficient 12S@18"*24"
Deviation increase and decrease Fixed increase and contracton, automatic increase and contraction, interval increase and contraction, partition alignment
File Format Gerber 274X, ODB++
Detailed Product Description

laser direct imaging (LDI) system solutions LDI Roll to Roll PCB

 

Advantages

Eliminate the mask processes.

 

Save time and cost of loading and unloading masks.

 

Reduce the deviation caused by the expansion and contraction of masks.

High image resolution and high yield.

 

High-precision

Minimum resolution1.2μm, Minimum line width25μm(Depending on the configuration)


PCB laser direct imaging (LDI)
When fabricating a circuit board, the circuit traces are defined by what is the imaging process. Laser direct imaging ( LDI ) exposes the traces directly with a highly focused laser beam that in NC controlled, instead of flooded light passing through a photo tool, a laser beam will digitally create the image.


How does laser direct imaging ( LDI ) work?
Laser direct imaging needs a PCB with the photo-sensitive surface that is positioned under a computer controlled laser. And then the computer is creating the image on the board with the light of laser. A computer scans the board surface into a raster image, matching the raster image to a pre-loaded CAD or CAM design file that includes the specifications for the necessary image intended for the board, the laser is used for directly creating the image on the board.

 

Specification/model RTR315
ApplicationPCB,HDI,FPC (inner layer,outer layer,anti-welding)
Resolution (mass production)15um
Capacity12S@18"*24"
Exposure Size260*800mm
Panel thickness0.05mm-3.5mm
Alignment ModeUV-Mark
Alignment capabilityOuter layer±12um;Inner laye±24um
Line width tolerance±10%
Deviation increase and decrease modeFixed increase and contraction, automatic increase and contraction, interval increase and contraction, partition alignment
Laser typeLD Laser,405±5nm
File formatGerber 274X;ODB++
Power380V three-phase alternating current, 6.4kW,50HZ, voltage fluctuation range + 7%     ~-10%
ConditionYellow light room; Temperature 22°C ± 1°C; Humidity 50% ± 5%; Cleanliness level 10000 and above;
Vibration requirements to avoid violent vibration near the equipment                            


About us
We are an innovative supplier of various PCB laser direct imaging (LDI) system solutions. Our system product portfolio ranges from LDI system configurations for high-mix and emerging PCB niche applications to fully automated LDI system solutions for mass production environments.

 

Product Tags: LDI direct imaging pcb   Roll To Roll direct imaging pcb   Three Phase ldi equipment  
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