Shenzhen Aochuan Technology Co., Ltd: Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for

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Shenzhen Aochuan Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-0755-29765652

Contact Person:
Mr.Jason Zhan View Contact Details

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silicone thermal pad

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Automotive Electronics Thermal Conductive Gap Filler

...) ≥5.0 ASTM D149 Dielectric Constant(@10mhz) 7.3 ASTM D150 Volume Resistivity(Ω.cm) 1.0*1014 ASTM D257 Flammability V-0 UL94 Thermal Thermal ... 2024-12-09 17:19:13

Anti Corrosion Potting Compound , Heat Resistant Electronic Thermal Conductive Gap Fillers

...Thermally Conductive Encapsulant With Silicone For Power Dissipation Attribute Value Test Method Composition Ceramic filler + Silicone - Color... 2024-12-09 17:19:13

1.8G/CC Durable Thermally Conductive Encapsulant For Power Battery

...Thermal Conductivity Silicone Encapsulating For Power Battery Attribute Value Test Method Composition Ceramic filler + Silicone - Color/Component A ... 2024-12-09 17:19:13

2 Part Thermal Conductive Gap Filler Multiscene Anticorrosive

...) ≥5.0 ASTM D149 Dielectric Constant(@10mhz) 7.3 ASTM D150 Volume Resistivity(Ω.cm) 1.0*1014 ASTM D257 Flammability V-0 UL94 Thermal Thermal ... 2024-12-09 22:03:00

Automotive Electronics Thermal Conductive Gap Filler

...) ≥5.0 ASTM D149 Dielectric Constant(@10mhz) 7.3 ASTM D150 Volume Resistivity(Ω.cm) 1.0*1014 ASTM D257 Flammability V-0 UL94 Thermal Thermal ... 2024-12-09 22:03:00

Power Supplies Thermal Gap Filler

...) ≥5.0 ASTM D149 Dielectric Constant(@10mhz) 7.3 ASTM D150 Volume Resistivity(Ω.cm) 1.0*1014 ASTM D257 Flammability V-0 UL94 Thermal Thermal ... 2024-12-09 22:03:00

Two Part Thermal Dispensable Gap Fillers

...) ≥5.0 ASTM D149 Dielectric Constant(@10mhz) 7.3 ASTM D150 Volume Resistivity(Ω.cm) 1.0*1014 ASTM D257 Flammability V-0 UL94 Thermal Thermal ... 2024-12-09 22:03:00

Anti Corrosion Potting Compound , Heat Resistant Electronic Thermal Conductive Gap Fillers

...Thermally Conductive Encapsulant With Silicone For Power Dissipation Attribute Value Test Method Composition Ceramic filler + Silicone - Color... 2024-12-09 22:03:00

1.8G/CC Durable Thermally Conductive Encapsulant For Power Battery

...Thermal Conductivity Silicone Encapsulating For Power Battery Attribute Value Test Method Composition Ceramic filler + Silicone - Color/Component A ... 2024-12-09 22:03:00

Electronic silicone gap filler Potting Compound Encapsulant Multiscene Practical

1.0W/m.K Thermal Conductivity Two Parts Silicone Base Gel Thermally Conductive Encapsulant Attribute Value Test Method Composition Ceramic filler + ... 2024-12-09 17:19:13

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