Shenzhen Aochuan Technology Co., Ltd: Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for

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Shenzhen Aochuan Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-0755-29765652

Contact Person:
Mr.Jason Zhan View Contact Details

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rohs thermal insulation pad

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Silicone Thermal Sheet CPU , Odorless Electrical Insulation Sheet Material

8 W/m.K Thermal Conductivity Pink 10 mm Thickness Thermal Pad Material For Heatsink Attribute Value Test Method Composition Ceramic Filler + Silicone ... 2024-12-09 17:19:32

Silicone Thermal Sheet CPU , Odorless Electrical Insulation Sheet Material

8 W/m.K Thermal Conductivity Pink 10 mm Thickness Thermal Pad Material For Heatsink Attribute Value Test Method Composition Ceramic Filler + Silicone ... 2026-04-06 00:29:56

Multiscene Thermal Sheet CPU, Nontoxic Ultra Soft Heating Pad

...insulation properties Flammability UL 94 V-0 Low thermal resistance Typical Applications Power Modules Heat generation power module Automotive ... 2024-12-09 17:19:13

Multiscene Thermal Sheet CPU, Nontoxic Ultra Soft Heating Pad

...insulation properties Flammability UL 94 V-0 Low thermal resistance Typical Applications Power Modules Heat generation power module Automotive ... 2024-12-09 22:03:00

Anti Interfere PCB Heat Sink Pad

Purple Heatsink Cooling Elevated Tempera Silicone Thermal Conductive Pad With 4.0W/m.K For LEDs Attribute Value Test Method Composition Ceramic Filler ... 2024-12-09 17:19:13

Anti Interfere PCB Heat Sink Pad

Purple Heatsink Cooling Elevated Tempera Silicone Thermal Conductive Pad With 4.0W/m.K For LEDs Attribute Value Test Method Composition Ceramic Filler ... 2024-12-09 22:03:00

AOK Ultrasoft Heat Sink Silicone Pad , CPU Gap Pad Thermal Conductivity

Low Thermal Resistance Thermal Conductive Silicone Pad For CPU With Die-Cuting Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2024-12-09 17:19:13

AOK Ultrasoft Heat Sink Silicone Pad , CPU Gap Pad Thermal Conductivity

Low Thermal Resistance Thermal Conductive Silicone Pad For CPU With Die-Cuting Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2026-04-06 00:29:56

Weather Resistant Ultra Soft Thermal Pad 0.5mm Thickness For EV

Ultra Soft Series 1.0W/m.K 0.5mm Thermal Thermal Silicone Pad For EV Attribute Value Test Method Composition Ceramic Filler, Silicone, and Reinforced ... 2024-12-09 17:19:32

Weather Resistant Ultra Soft Thermal Pad 0.5mm Thickness For EV

Ultra Soft Series 1.0W/m.K 0.5mm Thermal Thermal Silicone Pad For EV Attribute Value Test Method Composition Ceramic Filler, Silicone, and Reinforced ... 2026-04-06 00:29:56

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