Shenzhen Aochuan Technology Co., Ltd: Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for

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rohs high thermal conductivity compound

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Shenzhen Aochuan Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-0755-29765652

Contact Person:
Mr.Jason Zhan View Contact Details

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rohs high thermal conductivity compound

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Shockproof Durable Electrical Potting Compound , OBC Electronics Encapsulation gap filler thermal

...Thermally Conductive Encapsulant Potting Compound Silicone With OBC Attribute Value Test Method Composition Ceramic filler + Silicone - Color... 2024-12-09 17:19:13

Shockproof Durable Electrical Potting Compound , OBC Electronics Encapsulation gap filler thermal

...Thermally Conductive Encapsulant Potting Compound Silicone With OBC Attribute Value Test Method Composition Ceramic filler + Silicone - Color... 2024-12-09 22:03:00

RoHS Ultrasoft Heat Sink Rubber Pads , 5W Silicone Thermal Pad For CPU GPU Heatsink

Green Silicone High Thermal Conductive Pad With 5.0W/m.K For cpu thermal gap filler Attribute Value Test Method Composition Ceramic Filler + Silicone ... 2024-12-09 17:19:13

RoHS Ultrasoft Heat Sink Rubber Pads , 5W Silicone Thermal Pad For CPU GPU Heatsink

Green Silicone High Thermal Conductive Pad With 5.0W/m.K For cpu thermal gap filler Attribute Value Test Method Composition Ceramic Filler + Silicone ... 2026-04-06 00:29:56

UL Conductive Heat Sink Thermal Grease Multiscene Anti Insulation

... - Color White Visual Density(g/cc) 2.8 ASTM D792 Usage Temperature(℃) -40~150 -- Thermal Thermal conductivity(W/m.K) 1.0 ASTM D5470 Thermal ... 2024-12-09 17:19:13

UL Conductive Heat Sink Thermal Grease Multiscene Anti Insulation

... - Color White Visual Density(g/cc) 2.8 ASTM D792 Usage Temperature(℃) -40~150 -- Thermal Thermal conductivity(W/m.K) 1.0 ASTM D5470 Thermal ... 2024-12-09 22:03:00

Electronic silicone gap filler Potting Compound Encapsulant Multiscene Practical

1.0W/m.K Thermal Conductivity Two Parts Silicone Base Gel Thermally Conductive Encapsulant Attribute Value Test Method Composition Ceramic filler + ... 2024-12-09 17:19:13

Electronic silicone gap filler Potting Compound Encapsulant Multiscene Practical

1.0W/m.K Thermal Conductivity Two Parts Silicone Base Gel Thermally Conductive Encapsulant Attribute Value Test Method Composition Ceramic filler + ... 2024-12-09 22:03:00

Tablets Multiscene Silicone Heat Sink Compound For Electronics Anticorrosive

Non-Vulcanized Silicone Oil And Thermally Conductive Filler Mixture Heat Sink Thermal Grease Attribute Value Test Method Composition Non-Vulcanized ... 2024-12-09 17:19:13

Tablets Multiscene Silicone Heat Sink Compound For Electronics Anticorrosive

Non-Vulcanized Silicone Oil And Thermally Conductive Filler Mixture Heat Sink Thermal Grease Attribute Value Test Method Composition Non-Vulcanized ... 2024-12-09 22:03:00

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